One
of the major challenges in the realization of electronic devices
consisting of 2D materials produced using chemical vapor deposition
(CVD) is the transfer of the 2D material from the growth catalyst
to a relevant support material. However, the current steps of removing
contamination from the transfer process is rarely fully effective
with trace PMMA residue usually remaining. In this study, we explore
the use of size selected argon gas clusters to clean polymer residue
from CVD-grown commercial graphene samples. The energy per Ar atom
can be tuned to <0.5 eV/atom, significantly
below the bond strength of the graphene but sufficiently energetic
to remove polymer material. Two of the primary techniques for characterizing
the quality of graphene materials in terms of both chemical properties
and physical properties are X-ray photoelectron spectroscopy (XPS)
and Raman spectroscopy, respectively. However, these are typically
ex situ measurements and results can be heavily influenced by exposure
of the samples to atmospheric conditions prior to measurement. However,
by in situ monitoring the cleaning process through the use of a combined
XPS and Raman spectroscopy system, coupled with an argon gas cluster
ion beam (GCIB) and capable of carrying out each measurement simultaneously,
this allows us to explore in detail any modifications to the graphene
layer during the GCIB cleaning process. This investigation is further
enhanced with additional time-of-flight secondary ion mass spectrometry
(ToF-SIMS) imaging. Both the presence and removal of surface contamination
is shown, and the level of defects being introduced into the graphene
layer, as a result of the sputtering process, is monitored in real-time.
We show that by keeping the energy per argon atom less than 1 eV,
we can prevent the introduction of defects to the graphene layer,
as well as efficiently remove contamination present on the graphene
surface.