Multi-Line De-Embedding Technique for Millimeter-Wave Circuit Design

Bu, Qinghong; Li, N.; Takayama, Naoki; Okada, Kei; Matsuzawa, Akira

doi:10.7567/ssdm.2010.p-2-6

Cited by 3 publications

(4 citation statements)

References 1 publication

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The traditional open-short de-embedding method has been proven to be unsuitable to ultra-high frequencies due to its incapability for dealing with distributed nature in millimeter-wave frequency range based on assumptions of lumped equivalent circuit and ideal dummy patterns [16,17]. On the other hand, based on cascading distributive assumption, multi-line methods, including L-2L [18,19,20,21], and thru-based approaches such as thru-only [22], have been widely used for on-chip transmission line de-embedding [23,24]. The targets of the transmission line de-embedding include the determination of complex propagation constant and characteristic impedance.…”

Section: Introductionmentioning

confidence: 99%

Analysis of the parameter extraction for on-chip transmission lines

Yang

Zhang

et al. 2020

IEICE Electron. Express

View full text Add to dashboard Cite

Matching networks for ultra-high frequency chips are susceptible, and accurate extraction of passive devices parameters is essential. For on-chip transmission lines, the authors present a precise method of extracting transmission line propagation constant from two transmission line measurement structures with different lengths. After obtaining the propagation constant based on this method, to get the transmission line's characteristic impedance, this paper conducts a Y-Z model analysis of the signal pad and gives mathematical expressions. This approximation method can obtain the characteristic impedance of the transmission line without solving the signal pad's model parameters. The propagation constant and characteristic impedance derived from the methods proposed are compared with the corresponding electromagnetic simulation results, achieving fairly good agreement from 250 MHz to 110 GHz.

show abstract

Section: Introductionmentioning

confidence: 99%

Analysis of the parameter extraction for on-chip transmission lines

Yang

Zhang

et al. 2020

IEICE Electron. Express

View full text Add to dashboard Cite

show abstract

“…Therefore, ground-signal-ground (GSG) pads and GSG probes are used. 5 Thus, de-embedding work should be implemented to remove the effect of the GSG pads and the interconnects between pads and transistors.…”

Section: Introductionmentioning

confidence: 99%

“…Because the transistor is very small, it cannot be connected to the measurement equipment directly. Therefore, ground‐signal‐ground (GSG) pads and GSG probes are used . Thus, de‐embedding work should be implemented to remove the effect of the GSG pads and the interconnects between pads and transistors.…”

Section: Introductionmentioning

confidence: 99%

An improved open‐short equivalent circuit model for CMOS transistors de‐embedding

Wang

Kang

2019

Int J Numerical Modelling

View full text Add to dashboard Cite

In this paper, the open and short de-embedding structures are studied. The parallel terminal coupling effect, the loss of vias, and the interconnects are considered. On this basis, the above parasitic effects are characterized by the equivalent circuit model. To validate the model, open and short test structures are manufactured and measured. By comparing the measurement data with the modeling data, the proposed model achieves high accuracy. The rootmean-square error of scattering parameter is less than 0.0145 for the open model and less than 0.0082 for the short model.

show abstract

“…The TL de-embedding technique can characterize left and right pads under the assumption that left and right pads have the same characteristics while TRL de-embedding cannot characterize pads, without knowing characteristic impedance of the line used for example. Other de-embedding methods, such as double delay [6], throughonly [7], and multi line (or L-2L) de-embedding [8] [9], have been proposed. However, these all use approximation of pads, or parasitic component, by an equivalent circuit model while the TL de-embedding method treats pads rigorously with S-parameters.…”

Section: Introductionmentioning

confidence: 99%