2013
DOI: 10.1088/0022-3727/46/9/095301
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Multi-level conduction in NiO resistive memory device prepared by solution route

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Cited by 25 publications
(21 citation statements)
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“…Furthermore, in the light of CF model the observed multilevel switching behaviour can be explained in terms of gradual increase in filament size on increasing I CC during set process. 17 We propose that as I CC increases, the diameter of the CF-increases, consequently, the R ON decreases resulting in different R ON values. As a result, the reset voltage decreases with increasing I CC , as shown in Fig.…”
mentioning
confidence: 96%
“…Furthermore, in the light of CF model the observed multilevel switching behaviour can be explained in terms of gradual increase in filament size on increasing I CC during set process. 17 We propose that as I CC increases, the diameter of the CF-increases, consequently, the R ON decreases resulting in different R ON values. As a result, the reset voltage decreases with increasing I CC , as shown in Fig.…”
mentioning
confidence: 96%
“…In addition, ReRAM has multilevel data storage capability. The memory density can be increased efficiently with multilevel data storage, resulting in reduction of production cost of ReRAM 5 6 7 8 .…”
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confidence: 99%
“…3(b) with a dependence of HRS current on temperature in the form of I = I 0 exp(− /kT) where is the thermal activation energy with value of ∼410 meV. As discussed above in unipolar switching the switching between LRS and HRS Downloaded by [Heriot-Watt University] at 14:37 08 October 2014 is usually understood to be due to formation and rupture of conducting filament formed out of the metallic precipitates such as metallic nickel in NiO RRAM (13) and metallic Gadolinium in LaGdO 3 RRAM devices (14). TEM and XPS investigations have confirmed the presence of these metallic precipitates.…”
Section: Results and Discussonsmentioning
confidence: 99%