Multi-Layer RF Capacitors on Flexible Substrates Utilizing Inkjet Printed Dielectric Polymers

Inkjet‐Printed Smart Skins and Wirelessly‐Powered Sensors for Wearable Applications

“…Thin film dielectric inks exhibit printed layer thicknesses within the range of hundreds of nanometers to several micrometers. These low-profile polymeric ink materials, such as PVP and PMMA, have been demonstrated to be useful in the fabrication of purely additive passive components, such as metal-insulator-metal (MIM) capacitors and interconnects [4][5][6]. Figure 10.1 shows an array of fully inkjet-printed MIM capacitors using a PVP-based dielectric on a flexible polyimide Kapton substrate [4].…”

“…These low-profile polymeric ink materials, such as PVP and PMMA, have been demonstrated to be useful in the fabrication of purely additive passive components, such as metal-insulator-metal (MIM) capacitors and interconnects [4][5][6]. Figure 10.1 shows an array of fully inkjet-printed MIM capacitors using a PVP-based dielectric on a flexible polyimide Kapton substrate [4]. The printing process includes three steps: first the printing of metallic trace and bottom capacitive plate, followed by the printing of a single layer 300 nm thick polyvinylpyrrolidone (PVP) dielectric insulator, and concluded with a top capacitive plate and metallic trace.…”

Inkjet Printed Fully-Passive Body-Worn Wireless Sensors for Smart and Connected Community (SCC)

“…Several research papers described conductive electric track fabrication on various polymeric substrates using the IJP technique [43,44]. Shaker et al has demonstrated ultra-wideband (UWB) antenna on paper substrates [45], and Cook et al has demonstrated multi-layer radio frequency (RF) capacitors [46]. Efforts to develop electronic components using the IJP technique have also been reported [47,48].…”

3DInkPack—Inkjet Printing of Discrete Sensor Packages for Advanced Rapid Prototyping

“…In this context, multi-layered structuring has become an important research focus for the manufacturing of small electronic devices, such as smart cards, antennas, flexible driver circuits and sensors [2,3]. Conventional methods that fabricate these micro-devices waste a lot of material and require many working steps in terms of photolithography and etching and are therefore not the primary choice for R&D and prototyping purposes [4]. A purely additive manufacturing technique such as inkjet printing enables a sequential deposition and curing of several materials on top of each other, presenting itself as a very attractive technology for the multilayer structuring of micro-electronic devices.…”