MPPE/SEBS Composites with Low Dielectric Loss for High-Frequency Copper Clad Laminates Applications

Guo, Jianming; Wang, Hao; Zhang, Caixia; Zhang, Qilong; Ye, Hui

doi:10.3390/polym12091875

Cited by 45 publications

(23 citation statements)

References 33 publications

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“…The flexural strength of the composites is maintained above 40 Mpa, which can be attributed to the compactness of the composites. The SiO 2 shell can provide greater friction during the fracture process, so the flexural strength of the modified composites is higher [10]. As the filler content increases, the flexure strength of the composites decreases, which is due to the increase in internal defects of the composites.…”

Section: Coefficient Of Thermal Expansion and Mechanical Propertiesmentioning

confidence: 99%

“…Among the low-ε r and low-τ ε high-frequency substrates, the resin materials with good application prospects mainly include polytetrafluoroethylene (PTFE) [7,8], modified polypheylene ether (MPPE) [9,10], modified polyimide (MPI) [11], liquid crystal polymer (LCP) [12,13], etc. As an important engineering plastic, cyclic olefin copolymer (COC) is mainly used in optics, packaging materials, biomedicine, electronic components, and other fields [14,15].…”

Section: Introductionmentioning

confidence: 99%

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Core-Shell Sr2CeO4@SiO2 Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates

Wang

Zhang³

et al. 2021

Polymers

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High-frequency communication equipment urgently needs substrate materials with lower dielectric loss, better heat dissipation, and higher stability, to ensure real-time low-loss and high-speed signal transmission. The core-shell structure of Sr2CeO4@SiO2 was prepared by the sol-gel method, and the modified powders with different volume contents were introduced into the cyclic olefin copolymer (COC) to prepare hydrocarbon resin-based composites. Due to the protective effect of the SiO2 shell, the stability of the powders is significantly improved, and the moisture barrier and corrosion resistance of the composites are enhanced, which is conducive to the normal operation of electronic equipment in harsh and complex environments. When the filler content is 20 vol%, the composite has a dielectric loss of 0.0023 at 10 GHz, a dielectric constant of 3.5, a thermal conductivity of 0.9 W·m−1·K−1, a water absorption of 0.32% and a coefficient of thermal expansion of 37.7 ppm/°C. The COC/Sr2CeO4@SiO2 composites exhibit excellent dielectric properties and thermal conductivity, while maintaining good moisture resistance and dimensional stability, which shows potential application prospects in the field of high-frequency substrates.

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Section: Coefficient Of Thermal Expansion and Mechanical Propertiesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Core-Shell Sr2CeO4@SiO2 Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates

Wang

Zhang³

et al. 2021

Polymers

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“…is necessary. With respect to the electrical performance of insulation materials, low-loss Df (dissipation factor or loss tangent) and Dk (dielectric constant or permittivity) materials are highly preferred for 5G applications [ 10 , 11 ]. The recent results of the preparation and investigation of substituted ferrites, promising for microwave applications, have been published in [ 12 , 13 ].…”

Section: Introductionmentioning

confidence: 99%

Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications

Lee

Lau

et al. 2022

Materials

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In this study, the Df (dissipation factor or loss tangent) and Dk (dielectric constant or permittivity) of the low-loss dielectric material from three different vendors are measured by the Fabry–Perot open resonator (FPOR) technique. Emphasis is placed on the sample preparation, data collection, and the comparison with the data sheet values provided from vendors. A coplanar waveguide with ground (CPWG) test vehicle with one of these raw dielectric materials (vendor 1) is designed (through Polar and simulation) and fabricated. The impedance of the test vehicle is measured by TDR (time-domain reflectometer), and the effective Dk of the test vehicle is calculated by the real cross-section of the metal line width, spacing, and thickness of the test vehicle and a closed-form equation. In parallel, the insertion loss and return loss are measured with the VNA (vector network analyzer) of the test vehicle. Finally, the measurement and simulation results are correlated. Some recommendations on the low-loss dielectric materials of the Dk and Df are also provided.

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“…As a carrier of information transmission, the research on the substrate of copper clad laminate (Fung et al , 2012; Rui et al , 2011; Tasaki, 2019; Zhuo et al , 2011) has caught the attention. Therefore, Phenolic epoxy vinyl ester resin (PEVER) materials have been available for application in these fields, as of its low dielectric constant and dielectric loss (Choi et al , 2021; Guo et al , 2020; Tong et al , 2019; Wang et al , 2019; Wen et al , 2020).…”

Section: Introductionmentioning

confidence: 99%

High toughness, thermal resistance and excellent dielectric properties phenolic epoxy vinyl ester resin modified by hyperbranched polyimide

Gao

Zhang

Weng

et al. 2021

PRT

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Purpose Phenolic epoxy vinyl ester resin (PEVER) is an advanced resin matrix, which has excellent heat resistance, electrical insulation. However, the brittleness and poor toughness of its curing product limited its application, so this paper aims to modify the PEVER with hyperbranched polyimide (HBPI), so as to enhance the toughness, heat resistance and dielectric properties of PEVER. Design/methodology/approach Hexamethylene diisocyanate trimer was used as the central reactant. Methyl tetrahydrophthalic anhydride was used as the branching unit, stannous octoate was used as the catalyst and hydroquinone was prepared as the inhibitor. Then, the hyperbranched structure of HBPI was characterized by Fourier transform infrared spectrometer and 13C-NMR. Next, PEVER was mixed with different contents of HBPI, and then the authors tested its curing product. Findings It is found that with the addition of HBPI, the free volume of the system was increased and the content of polar groups was decreased in each unit space, so the dielectric constant (ε) and the dielectric loss (tanδ) were decreased. In addition, PEVER could be well toughened by HBPI and the thermal stability of PEVER was improved. Originality/value HBPI has excellent heat resistance. The addition of hyperbranched polymer increases the free volume of the system so it can slow down the transfer of stress and its nearly circular structure can absorb the impact energy from all directions. Moreover, an appropriate amount of free volume can decrease the dielectric constant of PEVER by reducing the content of polar groups.

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MPPE/SEBS Composites with Low Dielectric Loss for High-Frequency Copper Clad Laminates Applications

Cited by 45 publications

References 33 publications

Core-Shell Sr2CeO4@SiO2 Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates

Core-Shell Sr2CeO4@SiO2 Filled COC-Based Composites with Low Dielectric Loss for High-Frequency Substrates

Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications

High toughness, thermal resistance and excellent dielectric properties phenolic epoxy vinyl ester resin modified by hyperbranched polyimide

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