1992
DOI: 10.1007/bf00348140
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MOS transistors with epitaxial Si, laterally grown over SiO2 by liquid phase epitaxy

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Cited by 12 publications
(1 citation statement)
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“…ELO technique is used mainly to reduce defect density in lattice mismatched heteroepitaxial systems (see [3] for a review). However, homoepitaxial version the ELO technique also finds its practical application in production of silicon-on-insulator structures [4], MOS transistors [5], field effect transistors [6], solar cells [7], pressure sensors [8] and for three-dimensional device integration [9]. Usually, dielectric films (SiO 2 , Si 3 N 4 , etc.)…”
Section: Introductionmentioning
confidence: 99%
“…ELO technique is used mainly to reduce defect density in lattice mismatched heteroepitaxial systems (see [3] for a review). However, homoepitaxial version the ELO technique also finds its practical application in production of silicon-on-insulator structures [4], MOS transistors [5], field effect transistors [6], solar cells [7], pressure sensors [8] and for three-dimensional device integration [9]. Usually, dielectric films (SiO 2 , Si 3 N 4 , etc.)…”
Section: Introductionmentioning
confidence: 99%