A two-step potential
electrodeposition technique is described which
gives epitaxial films of Cu(100) on n-Si(100). Nucleation of epitaxial
seeds occurs at −1.5 VAg/AgCl, whereas the film is grown at −0.5 VAg/AgCl. Cu deposition occurs with a Faradaic efficiency of 82.0% as determined
spectrophotometrically. Epitaxy is achieved through a 45° in-plane
rotation of Cu with respect to Si, which is shown by X-ray analysis.
The 45° rotation reduces the lattice mismatch from −33.43%
for an unrotated film to −5.86% for a 45° rotated film.
Mosaicity, as determined via X-ray rocking curves, decreases with
increasing thickness, going from a full width at half maximum of 3.99°
for a 30 nm thick film to 1.67° for a 160 nm thick film. This
translates to an increasing quality of epitaxy with increasing thickness.
High resolution transmission electron microscopy imaging shows an
amorphous SiO
x
interlayer between Cu and
Si. Etching of SiO
x
with 5% HF allows
epitaxial lift-off of the copper film, giving single crystal-like
Cu(100) foils. Cu(100) films and single crystal-like foils have potential
to be used as catalysts for CO2 reduction, substrates for
technologically important materials like spintronic multilayer magnetic
stacks and high temperature superconductors, and as active surfaces
toward galvanic replacement by platinum group elements. Additionally,
the foils could be used as single crystal-like substrates for flexible
electronics.