Morphology, Thermal and Crystallization Properties of Polyamide-6/Boron Nitride (BN) Thermal Conductive Composites

Abstract

A series of the thermal conductive polyamide-6 (PA6) composites filled with boron nitride (BN) were prepared by two methods, including melting method (MM) and solution method (SM). The thermal conductivity, morphology, crystallization behavior, thermal stability, and rheological properties of PA6 composites were investigated. The results showed that the thermal conductivity of two methods increased with increase in the filler content, the thermal conductivity of PA6/BN composites containing 40 wt% BN prepared by melting method was up to 1.02 W•m-1 •K-1 , while the thermal conductivity of PA6/BN composites prepared by solution method was up to 1.

Thermal Performances of UHMWPE/BN Composites Obtained from Different Blending Methods

“…SM is superior to that of composites prepared by MM, which is consistent with the results of some researchers [38][39][40]. SM helps BN to physically adhere to the surface of UHMWPE particles, and composite materials with isolated structure can be prepared by molding, which results in improvement of thermal conductivity of UHMWPE/BN composites.…”

Thermal and electrical properties of aluminum nitride/boron nitride filled polyamide 6 hybrid polymer composites

“…From this Figure, XRD patterns of unfilled PA6 can be detected and particularly two main diffraction peaks present at 2θ = 20.1° and 23.7° were related to the (200) reflection and (002)/(202) reflections observed for the α‐crystalline form of PA6, respectively. These results were well correlated with the literature 7,34,45 . It can be noticed that the reflection peaks (2θ = 10.7° and 21.4°) ascribed to (020) and (001) crystal planes of γ‐crystalline form of PA6 are absent 45 .…”

“…These results were well correlated with the literature. 7,34,45 It can be noticed that the reflection peaks (2θ = 10.7 and 21.4 ) ascribed to (020) and (001) crystal planes of γ-crystalline form of PA6 are absent. 45 At the same time, Figure 7 indicated that the characteristic peaks of the α-crystalline form of PA6 were present in the XRD patterns of the 10, 30, and 50 vol% filled PA6/AlN/BN hybrid composites.…”

“…The hybrid‐shaped PPS/BN polymer composite exhibits a thermal conductivity of 2.04 W/m K for a filler content of 33.3 vol%, while the results obtained for PPS/BN polymer composites containing uniform spherical and uniform platelet shaped fillers at the same filler content were 1.77 and 1.55 W/m K respectively 6 . Another work showed that the thermal conductivity of polyamide 6 (PA6)/BN composites prepared at 40 wt% of BN was improved up to 1.02 W/m K for samples prepared by melting method and up to 1.44 W/m K for samples prepared by solution method 7 . In addition, the study on the comparison of thermal conductivities obtained for BN and hexagonal boron nitride nanosheet (BNNS) filled PA6 composites demonstrated that the PA6/BNNS composites exhibit higher thermal conductive properties (2.496 W/m K at 40 wt%) 8 .…”

“…6 Another work showed that the thermal conductivity of polyamide 6 (PA6)/BN composites prepared at 40 wt% of BN was improved up to 1.02 W/m K for samples prepared by melting method and up to 1.44 W/m K for samples prepared by solution method. 7 In addition, the study on the comparison of thermal conductivities obtained for BN and hexagonal boron nitride nanosheet (BNNS) filled PA6 composites demonstrated that the PA6/BNNS composites exhibit higher thermal conductive properties (2.496 W/m K at 40 wt%). 8 The investigation of hexagonal BN and flame retardant filled PA6 composites resulted in the improvement of the thermal conductivity of the composite up to 5.701 W/m K at 40 vol%.…”