Thermal and electrical properties of aluminum nitride/boron nitride filled polyamide 6 hybrid polymer composites

Abstract

The effects of boron nitride (BN) and aluminum nitride fillers on polyamide 6 (PA6) hybrid polymer composites were investigated. In particular, the thermal and electrical conductivity, thermal transition, thermal degradation, mechanical and morphological properties and chemical bonds characteristic of the materials with crystal structure of BN and aluminum nitride (AlN) filled PA6 prepared at different concentrations were characterized. Thermal conductivity of hybrid systems revealed a 1.6‐fold gain compared to neat PA6. The highest thermal conductivity value was obtained for the composite containing 50 vol% additives (1.040 W/m K). A slight improvement in electrical conductive properties of composites appears and the highest value was obtained for the 50 vol% filled composite with only an increase by 3%. The microstructure of these composites revealed a homogeneous dispersion of AlN and BN additives in PA6 matrix. For all composites, one visible melting peak around 220°C related to the α‐form crystals of PA6 was detected in correlation with the X‐ray diffraction results. An improved thermal stability was obtained for 10 vol% AlN/BN filled PA6 composite (from 405.41°C to 409.68°C). The tensile strength results of all composites were found to be approximately 22% lower than pure PA6.

Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging

“…Figure 3 a illustrates the arrangement of different fillers within the epoxy matrix, Figure 3 b shows the reaction between the functionalized fillers and EP, and Figure 3 c displays the FTIR spectra of EP and different composites prepared at the highest feasible filler loading achieved in this study. The wide absorption band observed at approximately 551 cm −1 on AlN/EP was ascribed to the Al–N stretching vibration [ 52 , 53 , 54 ], and the broad peak at approximately 533 cm −1 for the AlN–BN/EP composite. Furthermore, in the curves of BN/EP and AlN–BN/EP, two prominent absorption peaks at approximately 751 and 1366 cm −1 were assigned to the out-of-plane bending vibration of B–N–B and in-plane stretching vibration of B–N, respectively [ 55 , 56 , 57 , 58 ].…”

“…Good dispersibility of the hybrid fillers in the composite enhanced the polymer–filler interfacial interaction, restraining the kinetic movement of the polymer molecular chains. As a result, the thermal stability of EP composites was indirectly improved [ 17 , 25 , 34 , 53 , 54 ]. The AlN–BN/EP composite shows exceptional thermal resistance, meaning that it can successfully shield the die and bumps from thermal decomposition, which makes it a very promising electronic underfill material.…”

3D‐printed surface‐modified aluminum nitride reinforced thermally conductive composites with enhanced thermal conductivity and mechanical strength

“…Among the ceramic fillers, aluminum nitride (AIN) is most suitable for use as a filler in polymer composites because of its high theoretical thermal conductivity (319 W/mK), good electrical insulation, low coefficient of thermal expansion, and high mechanical strength 8–11 . Wei et al prepared honeycomb composites by freeze‐casting of AlN and subsequent infiltration of epoxy, to achieve an in‐plane and out‐of‐plane thermal conductivity of 9.48 and 4.45 W/mK, respectively, at 47.26 vol.% AlN loading 8 .…”

Novel aspects derived from the influence of dispersion properties of poly(4‐vinylpyridine)/aluminum nitride nanocomposite encapsulants on light‐extraction efficiency of light emitting diodes

“…The heat resistance of the P4VPy‐based composites is less studied in literature, 36 which reveals that incorporation of organophilic montmorillonite in this matrix determines the increase of the decomposition onset temperature of the corresponding composites. The degradation of the P4VPy/AlN is not reported, but several reports prove that addition of this filler in polymers (like polystyrene or polyamide 6) is not significantly affecting the heat resistance of the matrix 37,38 . So, it is expected that loading of the P4VPy with AlN would render materials with good heat resistance.…”