Morphology of thick film metallization on aluminum nitride ceramics and composition of interface layer

Zhang, Pengfei; Fu, Renli; Tang, Yuxiang; Cao, Bing; Meng, F.; Yang, Yang

doi:10.1016/j.ceramint.2015.07.125

Cited by 22 publications

(2 citation statements)

References 18 publications

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“…The TPC technology adopted the screen printed technology to produce conductive patterns in the ceramic surface without an need for extra etching process. However, the printed paste contained the glass phase was supposed to adversely affect thermal conductivity [20]. In addition, the voids were inevitable in the Cu layer due to the sintering process, which was also a disadvantage [21].…”

Section: Introductionmentioning

confidence: 99%

Fabrication of AlN/Cu composite structure via laser metallization assisted direct bonding technology

Song

Chen

Wang

et al. 2023

Preprint

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In this work, an innovative and cost-effect method was proposed to fabricate AlN/Cu composite structure. The AlN ceramic was metallized by nanosecond laser irradiation without consuming extra materials. The metallurgical combination between AlN ceramic and Cu was successfully achieved based on the Al-Cu eutectic reaction at a relatively low temperature of 620 ℃. Under the laser irradiation, the AlN ceramic was thermal decomposed to form Al laeyer and microgroove. As the laser power increased, more Al was produced on the the ceramic surface and the micgroove became deeper. The microstructure, mechanical and heat transfer properties of the AlN/Cu joints were investigated. The maximum shear strength of the joint was 11.25MPa when the laser power was 56 W, and the maximum thermal conductivity was 162 W/(m·K) when the laser power was 42 W. The approach of laser-induced direct metallization of ceramics in this work provides a novel strategy for the integration of ceramics/metals composite structures.

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Section: Introductionmentioning

confidence: 99%

Fabrication of AlN/Cu composite structure via laser metallization assisted direct bonding technology

Song

Chen

Wang

et al. 2023

Preprint

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“…However, the sandwich structure of DBA/AMB substrates also results in a large amount of thermomechanical stress induced by the difference in the CTE between metal and ceramic in the sandwich structure under high temperatures [5,9,10,11]. The repeated thermomechanical stress finally induces the fracture of DBA/AMB substrates [12].…”

Section: Introductionmentioning

confidence: 99%

Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules

et al. 2018

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The thermal cycling life of direct bonded aluminum (DBA) and active metal brazing (AMB) substrates with two types of plating—Ni electroplating and Ni–P electroless plating—was evaluated by thermal shock tests between −50 and 250 °C. AMB substrates with Al2O3 and AlN fractured only after 10 cycles, but with Si3N4 ceramic, they retained good thermal stability even beyond 1000 cycles, regardless of the metallization type. The Ni layer on the surviving AMB substrates with Si3N4 was not damaged, while a crack occurred in the Ni–P layer. For DBA substrates, fracture did not occur up to 1000 cycles for all kind of ceramics. On the other hand, the Ni–P layer was roughened and cracked according to the severe deformation of the aluminum layer, while the Ni layer was not damaged after thermal shock tests. In addition, the deformation mechanism of an Al plate on a ceramic substrate was investigated both by microstructural observation and finite element method (FEM) simulation, which confirmed that grain boundary sliding was a key factor in the severe deformation of the Al layer that resulted in the cracking of the Ni–P layer. The fracture suppression in the Ni layer on DBA/AMB substrates can be attributed to its ductility and higher strength compared with those of Ni–P plating.

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Scratch and wear behaviours of metallised Ti thin films deposited on Al2O3 substrate

et al. 2018

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Morphology of thick film metallization on aluminum nitride ceramics and composition of interface layer

Cited by 22 publications

References 18 publications

Fabrication of AlN/Cu composite structure via laser metallization assisted direct bonding technology

Fabrication of AlN/Cu composite structure via laser metallization assisted direct bonding technology

Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules

Scratch and wear behaviours of metallised Ti thin films deposited on Al2O3 substrate

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