Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules

Abstract

The thermal cycling life of direct bonded aluminum (DBA) and active metal brazing (AMB) substrates with two types of plating—Ni electroplating and Ni–P electroless plating—was evaluated by thermal shock tests between −50 and 250 °C. AMB substrates with Al2O3 and AlN fractured only after 10 cycles, but with Si3N4 ceramic, they retained good thermal stability even beyond 1000 cycles, regardless of the metallization type. The Ni layer on the surviving AMB substrates with Si3N4 was not damaged, while a crack occurred in the Ni–P layer. For DBA substrates, fracture did not occur up to 1000 cycles for all kind of ceramics. On the other hand, the Ni–P layer was roughened and cracked according to the severe deformation of the aluminum layer, while the Ni layer was not damaged after thermal shock tests. In addition, the deformation mechanism of an Al plate on a ceramic substrate was investigated both by microstructural observation and finite element method (FEM) simulation, which confirmed that grain boundary sliding was a key factor in the severe deformation of the Al layer that resulted in the cracking of the Ni–P layer. The fracture suppression in the Ni layer on DBA/AMB substrates can be attributed to its ductility and higher strength compared with those of Ni–P plating.

Real-Time Acoustic Emission Monitoring of Wear-Out Failure in SiC Power Electronic Devices During Power Cycling Tests

“…The AMB consisted of a Si3N4 ceramic plate of 0.32 mm thickness and two Cu metallized layers with 0.30 mm thickness. Among the three types of ceramic including Al2O3, AlN, and Si3N4 in AMB substrates, the Si3N4 based AMB substrate was selected because it exhibited the highest thermal damage resistance [24] [25]. To focus on failure monitoring of Al ribbons in the discrete device, micron Ag sinter paste [26] was selected as the die attach material because it exhibited a higher thermal resistance when compared to that of traditional high-temperature solder [8], [27], [28].…”

Effect of interfacial microstructure evolution on the peeling strength and fracture of AMB Cu‐metalized AlN substrate

“…14 Therefore, AMB copper-metalized AlN substrates possess superior reliability. 15,16 To alleviate the thermal stress and improve the bonding strength of the AlN/Cu interface, various particles have been added to the Ag-Cu-Ti brazing alloy, such as TiN, 17 TiC, 18 and SiC. 19 The addition of particles can reduce plastic deformation, which may affect the thermal cycling life of the AMB Cu-metalized AlN substrates.…”

“…Researchers from Mitsubishi Materials Corporation used a printed Ag-Ti layer to replace Ag-Cu-Ti paste for brazing AlN substrates and copper foils under 0.1 MPa A survey of the published literature shows that process modeling of CMCs has been studied by a number of researchers. Processes that have been modeled include RMI, 15,16 CVD, 17,18 CVI, [19][20][21][22] and Sol-Gel Infiltration. 23 Impregnation of alumina matrix in eight-harness satin Nextel 610 fabric has been studied numerically in Ref.…”

“…Compared with the Al 2 O 3 –Cu 2 O eutectic layer produced by DBC, the TiN reaction layer formed by AMB exhibits reduced interfacial thermal resistance and enhanced bonding strength 14 . Therefore, AMB copper‐metalized AlN substrates possess superior reliability 15,16 . To alleviate the thermal stress and improve the bonding strength of the AlN/Cu interface, various particles have been added to the Ag‐Cu‐Ti brazing alloy, such as TiN, 17 TiC, 18 and SiC 19 .…”

Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining

“…It has been reported that heat resistance of the substrate depending on the type of ceramics and metals [20,21,22]. In this regard, our group carried out to evaluate thermo-mechanical stability of various ceramic applied active metal brazed (AMB) DBC substrates with the Ni plating layer during a harsh thermal shock cycling test at the temperature range of from −50 °C to 250 °C [23]. The DBC substrate with silicon nitride (Si 3 N 4 -DBC) ceramics middle layer indicate no serious damage within 1,000 cycles of thermal shock cycles, while those of an aluminum nitride (AlN) and alumina (Al 2 O 3 ) caused by Cu layer severe delamination after the same cycles [23].…”