Morphology of plasma polymerized methyl methacrylate films

Li, Guifang; Tobin, Jeffrey A.; Denton, Denice D.

doi:10.1063/1.111103

Cited by 13 publications

(10 citation statements)

References 14 publications

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“…In recent years, the application of AFM to surface morphology studies of polymers has grown rapidly. It has already been used to study polyethylene, polypropylene, polyaniline, , polypyrrole, , methyl methacrylate, crystallized or polymerized in situ , and nylon films, to mention a few. Several studies on oxygen-plasma-treated polymer films have been conducted, for example, on the following: polypropylene, − poly(tetrafluoroethylene) (PTFE), and polyimide film .…”

Section: Introductionmentioning

confidence: 99%

Application of AFM on the Adhesion Studies of Oxygen-Plasma-Treated Polypropylene and Lignocellulosics

et al. 1999

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Atomic force microscopy was used to study the surfaces of oxygen-plasma-treated polypropylene (PP), kraft pulp, filter paper, and wood. The effect of plasma treatment on the adhesion properties between PP film and wood was evaluated by means of a peel test. The highest adhesion to wood resulted from the shortest treatment times used. The effects of plasma on the adhesion properties were more pronounced when both the PP film and the wood surface were treated. Oxygen plasma caused changes in the morphology of the materials: the treated PP surface was covered by a nodular structure, which was not seen on the untreated film. A similar nodular structure was also seen on the lignocellulosic materials. These nodules seemed to have poor interaction with the PP surface, resulting in a weak interface between the plastic film and wood.

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Section: Introductionmentioning

confidence: 99%

Application of AFM on the Adhesion Studies of Oxygen-Plasma-Treated Polypropylene and Lignocellulosics

et al. 1999

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“…Other investigations of PPMMA film applications include self‐curing bone cements, 7 waveguides, 8 and humidity sensor material 9. Li et al reported on the photoluminescence (PL)10 and morphology11 of PPMMA films, and the PL was found to be a one‐photon fluorescence process with a lifetime on the order of a few nanoseconds 10…”

Section: Introductionmentioning

confidence: 99%

Plasma dissociation reaction kinetics. I. Methyl methacrylate

Pan

Denton

1999

J. Appl. Polym. Sci.

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Fourier transform infrared spectroscopy (FTIR) was utilized to study the plasma gas-phase reaction kinetics and reaction mechanisms in capacitively coupled glow discharges of methyl methacrylate (MMA) under zero monomer flow rate conditions. The gas-phase study shows two major electron-impact-induced dissociation pathways in MMA plasmas: the C-O bond cleavage reaction and decarboxylations. The C-O bond cleavage reaction accounts for approximately one-half of the MMA dissociation, and neutral formaldehyde and dimethyl ketene (DMK) are produced via intramolecular rearrangement. Decarboxylations produce CO, CO 2 , and a number of radicals that subsequently stabilize to form neutrals, including propylene, allene, and methanol. These intermediate species then further dissociate in the plasma to small hydrocarbons (methane, acetylene, and ethylene), CO, CO 2 , and H 2 . Plasma power and initial monomer pressure have only minor effects on the MMA fragmentation chemistry. However, the reaction rate increases at higher-power and lower initial monomer pressure conditions. The modeling also reveals the relative reactivities of the neutrals. A time-scale transformation technique based on the MMA decomposition half-life significantly reduces the effects of the reactor condition on the kinetics. In addition, mass balance ratios are utilized to calculate the portion of plasma species that have been accounted for by the in situ technique.

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“…On a relatively small scale ͑1 m 2 ͒, the PPMS surface exhibits only nanometer-scale features as in the case of plasma polymerized methyl methacrylate. 12 The observed root mean square ͑rms͒ roughness is less than 0.5 nm independently of the deposition conditions used.…”

Section: A Morphology and Stressmentioning

confidence: 92%

Plasma polymerized methylsilane I: Characterization of thin photosensitive films for advanced lithography applications

Monget

Joubert

Inglebert

2000

Journal of Vacuum Science &Amp; Technology B: Microelectronics and Nanometer Structures Processing, Measurement, and Phenomena

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Articles you may be interested inComposition, structural, and electrical properties of fluorinated silicon-nitride thin films grown by remote plasmaenhanced chemical-vapor deposition from SiF 4 / NH 3 mixtures J. Vac. Sci. Technol. A 22, 570 (2004); 10.1116/1.1699335Effect of hydrogen dilution on the structure of SiOF films prepared by remote plasma enhanced chemical vapor deposition from SiF 4 -based plasmasOptical and compositional study of silicon oxide thin films deposited in a dual-mode (microwave/radiofrequency) plasma-enhanced chemical vapor deposition reactor Plasma polymerized methylsilane ͑PPMS͒ films are promising photosensitive layers for 248 and 193 nm lithography applications. These a-Si 1Ϫx C x :H films are deposited in a low power plasma of methylsilane gas using a commercial tool. The effect of substrate temperature, pressure in the chamber and rf power injected in the source on optical properties and chemical composition of the PPMS films have been studied using spectroscopic ellipsometry and Fourier transform infrared ͑FTIR͒ spectroscopy. FTIR experiments show that the PPMS structure is organized around a Si:H network with intact methyl groups. The correlation between deposition parameters and PPMS films properties is discussed.

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Morphology of plasma polymerized methyl methacrylate films

Cited by 13 publications

References 14 publications

Application of AFM on the Adhesion Studies of Oxygen-Plasma-Treated Polypropylene and Lignocellulosics

Application of AFM on the Adhesion Studies of Oxygen-Plasma-Treated Polypropylene and Lignocellulosics

Plasma dissociation reaction kinetics. I. Methyl methacrylate

Plasma polymerized methylsilane I: Characterization of thin photosensitive films for advanced lithography applications

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