Morphology and mechanical properties of nanocrystalline Cu/Ag alloy

Li, A.; Szlufarska, Izabela

doi:10.1007/s10853-016-0700-3

Cited by 36 publications

(16 citation statements)

References 35 publications

(58 reference statements)

Supporting

Mentioning

Contrasting

Order By: Relevance

“…In recent years, with the rapid development of the aerospace industry, micro-electronics, communication, medicine, life sciences, and so on, there is a high request for copper alloy’s various indicators and the capacity of adapting to an environment, such as possessing high strength and high conductivity simultaneously [1,2,3,4]. It is hard to improve the strength of copper, which always comes at the price of conductivity reduction.…”

Section: Introductionmentioning

confidence: 99%

Microstructure and Enhanced Properties of Copper-Vanadium Nanocomposites Obtained by Powder Metallurgy

Wang

Zou

et al. 2019

Materials

View full text Add to dashboard Cite

Cu-2.4 wt.%V nanocomposite has been prepared by mechanical alloy and vacuum hot-pressed sintering technology. The composites were sintered at 800 °C, 850 °C, 900 °C, and 950 °C respectively. The microstructure and properties of composites were investigated. The results show that the Cu-2.4 wt.%V composite presents high strength and high electrical conductivity. The composite sintered at 900 °C has a microhardness of 205 HV, a yield strength of 404.41 MPa, and an electrical conductivity of 79.5% International Annealed Copper Standard (IACS); the microhardness and yield strength reduce gradually with the increasing consolidation temperature, which is mainly due to the growth of copper grain size. After sintering, copper grain size and V nanoparticle both maintain in nanoscale; the strengthening mechanism is related to grain boundary strengthening and dispersion strengthening, while the grain boundary strengthening mechanism plays the most important role. This study indicates that the addition of small amounts of V element could enhance the copper matrix markedly with the little sacrifice of electrical conductivity.

show abstract

Section: Introductionmentioning

confidence: 99%

Microstructure and Enhanced Properties of Copper-Vanadium Nanocomposites Obtained by Powder Metallurgy

Wang

Zou

et al. 2019

Materials

View full text Add to dashboard Cite

show abstract

“…To rectify these contrasting reports of the effect of grain boundary doping on dislocation emission, we turn to the concept of excess grain boundary free volume. Previous studies have found an inverse relationship between grain boundary free volume and yield stress, demonstrating that solute addition to grain boundaries leads to a decrease in grain boundary free volume and an associated increase in yield strength for the alloys that were studied [41,42]. Tucker and…”

Section: Dislocation Emissionmentioning

confidence: 86%

Grain boundary complexions and the strength of nanocrystalline metals: Dislocation emission and propagation

Turlo

Rupert

2018

Acta Materialia

View full text Add to dashboard Cite

Grain boundary complexions have been observed to affect the mechanical behavior of nanocrystalline metals, improving both strength and ductility. While an explanation for the improved ductility exists, the observed effect on strength remains unexplained. In this work, we use atomistic simulations to explore the influence of ordered and disordered complexions on two deformation mechanisms which are essential for nanocrystalline plasticity, namely dislocation emission and propagation. Both ordered and disordered grain boundary complexions in Cu-Zr are characterized by excess free volume and promote dislocation emission by reducing the critical emission stress. Alternatively, these complexions are characterized by strong dislocation pinning regions that increase the flow stress required for dislocation propagation. Such pinning regions are caused by ledges and solute atoms at the grain-complexion interfaces and may be dependent on the complexion state as well as the atomic size mismatch between the matrix and solute elements. The trends observed in our simulations of dislocation propagation align with the available experimental data, suggesting that dislocation propagation is the rate-limiting mechanism behind plasticity in nanocrystalline Cu-Zr alloys.

show abstract

“…Similarly, Tsivoulas and Robson [58] observed Zr enrichment along dislocations, followed by Al3Zr precipitation in the as-cast and fully homogenised Al-Cu-Li based alloys. Second, Zr [21][22][23] and Ag [40,41] addition by themselves have been reported to facilitate AIF formation in the Cu-Ag and Cu-Zr binary systems. Therefore, the Cu-Zr-Ag alloy is an obvious candidate to explore the effect of a shift to ternary chemical compositions.…”

Section: Methodsmentioning

confidence: 99%

Atomistic modeling of interfacial segregation and structural transitions in ternary alloys

Rupert

2018

J Mater Sci

View full text Add to dashboard Cite

Grain boundary engineering via dopant segregation can dramatically change the properties of a material. For metallic systems, most current studies concerning interfacial segregation and subsequent transitions of grain boundary structure are limited to binary alloys, yet many important alloy systems contain more than one type of dopant. In this work, hybrid Monte Carlo/molecular dynamics simulations are performed to investigate the behavior of dopants at interfaces in two model ternary alloy systems: Cu-Zr-Ag and Al-Zr-Cu. Trends in boundary segregation are studied, as well as the propensity for the grain boundary structure to become disordered at high temperature and doping concentration. For Al-Zr-Cu, we find that the two solutes prefer to occupy different sites at the grain boundary, leading to a synergistic doping effect. Alternatively, for Cu-Zr-Ag, there is site competition because the preferred segregation sites are the same. Finally, we find that thicker amorphous intergranular films can be formed in ternary systems by controlling the concentration ratio of different solute elements.

show abstract

Morphology and mechanical properties of nanocrystalline Cu/Ag alloy

Cited by 36 publications

References 35 publications

Microstructure and Enhanced Properties of Copper-Vanadium Nanocomposites Obtained by Powder Metallurgy

Microstructure and Enhanced Properties of Copper-Vanadium Nanocomposites Obtained by Powder Metallurgy

Grain boundary complexions and the strength of nanocrystalline metals: Dislocation emission and propagation

Atomistic modeling of interfacial segregation and structural transitions in ternary alloys

Contact Info

Product

Resources

About