Abstract:The microstructure of copper layers obtained by electrodeposition in stationary, pulsed and stochastic modes on copper substrates was studied by means of scanning electron microscopy. It was found that the shape of the applied grains differs significantly in the case of pulsed and stationary application modes. The technology of production of electrodeposited layers in stationary, pulse and stochastic modes of copper on copper substrates is worked out in the work. The developed automated software and hardware c… Show more
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