2008
DOI: 10.1149/1.2952659
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Morphological and Photoelectrochemical Properties of ALD TiO[sub 2] Films

Abstract: TiO 2 films were grown by atomic layer deposition ͑ALD͒ at 200-500°C with TiCl 4 and H 2 O as gas sources. The relationships among deposition temperature, microstructure, and photoelectrochemical properties were investigated. The results showed that the crystalline form is anatase at deposition temperatures of 200-400°C and is a mixture of anatase and rutile at 500°C. The grain size changed with the deposition temperature and had a minimum at around 400°C. The potential sweep voltammograms demonstrated that th… Show more

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Cited by 60 publications
(58 citation statements)
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“…Figure 7 shows that the mean crystallite size has a minimum at 400 o C and increases with increasing deposition temperature, as expected from previous studies [26]. Increasing crystallite size with increasing deposition temperature has been observed for atomic layer deposited TiO 2 coatings on silicon substrates and has been attributed to the composite effect of nucleus density and grain coalescence with temperature [31]. According to Cheng and Chen [31], increasing the deposition temperature yields a higher subsequent crystallite nucleation and coalescence resulting in a coarser crystallite size.…”
Section: Methodssupporting
confidence: 83%
See 1 more Smart Citation
“…Figure 7 shows that the mean crystallite size has a minimum at 400 o C and increases with increasing deposition temperature, as expected from previous studies [26]. Increasing crystallite size with increasing deposition temperature has been observed for atomic layer deposited TiO 2 coatings on silicon substrates and has been attributed to the composite effect of nucleus density and grain coalescence with temperature [31]. According to Cheng and Chen [31], increasing the deposition temperature yields a higher subsequent crystallite nucleation and coalescence resulting in a coarser crystallite size.…”
Section: Methodssupporting
confidence: 83%
“…Increasing crystallite size with increasing deposition temperature has been observed for atomic layer deposited TiO 2 coatings on silicon substrates and has been attributed to the composite effect of nucleus density and grain coalescence with temperature [31]. According to Cheng and Chen [31], increasing the deposition temperature yields a higher subsequent crystallite nucleation and coalescence resulting in a coarser crystallite size. Figure 8 gives the EDS measurements of the O:Ti ratio and the presence of iron in the films deposited over a range of temperatures but having the same thickness.…”
Section: Methodsmentioning
confidence: 98%
“…Same tendency of the surface morphology change was reported by others. [15][16][17] The effect of nucleus density at the lower temperature is more pronounced than that of grain coalescence, thus causes the larger grain size. 17 On the other hand, much denser nuclei are formed at higher temperatures, which results in smaller grains.…”
Section: A Surface Roughness and Crystallizationmentioning
confidence: 99%
“…[15][16][17] The effect of nucleus density at the lower temperature is more pronounced than that of grain coalescence, thus causes the larger grain size. 17 On the other hand, much denser nuclei are formed at higher temperatures, which results in smaller grains. However, according to our RMS data, once crystallization happened during deposition, the roughness issue would exist even for the films with smaller grains.…”
Section: A Surface Roughness and Crystallizationmentioning
confidence: 99%
“…Then, wafers were rinsed in deionized water and dried with N 2 gas. Right after the cleaning, Si substrate was placed in the reaction chamber and then the chamber temperature was raised to 200 • C for the ALD deposition [28].…”
Section: Methodsmentioning
confidence: 99%