Morphological and Mechanical Behaviour of Cu–Sn Alloys—A review

Karthik, M.; Abhinav, J.; Shankar, Karthik V.

doi:10.1007/s12540-020-00899-z

Cited by 38 publications

(12 citation statements)

References 122 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The mechanical parameters and mechanical behaviors of polycrystalline Cu and Nb are summarized in table 4. The mechanical parameters of bronze are obtained by [99]. Figure 18(a) shows the comparison of the simulated and experimentally measured stress-strain curves for the coarsegrained copper with 25 µm average grain size and fine-grained copper with 0.5 µm average grain size, respectively.…”

Section: Numerically Simulated Results Of Polycrystalline Niobium And...mentioning

confidence: 99%

Numerical simulation of mechanical behaviors and intergranular fracture of polycrystalline Nb₃Sn and superconducting filaments

Ding

Marzi

Gao

2023

Supercond. Sci. Technol.

View full text Add to dashboard Cite

Given the importance of large-scale engineering applications of the superconducting compound Nb3Sn, both its use and performance under certain operating conditions have attracted the interest of applied superconductivity researchers and material scientists for several years now. Huge efforts are directed toward understanding the response to applied loads and predicting fracture damage within their internal microstructure; this is fundamental in the design of superconducting coils and magnets which must meet stringent requirements in terms of maximum thermal and electromagnetic loads. In this paper, the fracture behaviors in polycrystalline Nb3Sn and Nb3Sn filaments with composite structures are investigated using the micromechanical finite element (FE) models with Voronoi tessellation. First, the 2D and 3D Voronoi FE models of the polycrystalline Nb3Sn tensile tests are developed and validated to provide insight into the cracking behavior in the intergranular brittle fracture of polycrystalline Nb3Sn. A cohesive zone model is used to simulate crack propagation at the grain level model including grain boundary zones. It is found that the pre-existing cracks of polycrystals and martensitic phase transformation of grains significantly impact the fracture properties in polycrystalline Nb3Sn. Second, detailed FE models of powder-in-tube (PIT) and bronze route (BR) filaments with Voronoi structures for fracture analysis are then developed on the basis of experimental observations of sectional morphologies. The mechanism of crack initiation and propagation under tensile load have been investigated by analyzing the mechanical properties of each component and the characteristics of multi-scale composite structures of filaments. Furthermore, the damage situation is investigated in PIT filaments undergoing transverse compressive load. The proposed simulation method in this paper can be extended to the fracture and damage analysis of Nb3Sn superconducting wires with different layouts and fabrication processes.

show abstract

Section: Numerically Simulated Results Of Polycrystalline Niobium And...mentioning

confidence: 99%

Numerical simulation of mechanical behaviors and intergranular fracture of polycrystalline Nb₃Sn and superconducting filaments

Ding

Marzi

Gao

2023

Supercond. Sci. Technol.

View full text Add to dashboard Cite

show abstract

“…The electrodeposition of CuSn alloys have been extensively reported in literature, as Cu-Sn alloys are typically used for industrial applications because of their mechanical strength and corrosion resistance. 24,25 Typically, CuSn films are produced from baths that include a complexing agent, a vital component for successful co-deposition. 26 The citrate ion derived from trisodium citrate salt (Na 3 Cit) is of key importance among these compounds.…”

Section: Voltammetric Studiesmentioning

confidence: 99%

New generation copper-based interconnection from nanoporous CuSn alloy film sintered at low temperatures

Castillo,

Pasha,

Larson

et al. 2024

Mater. Adv.

View full text Add to dashboard Cite

show abstract

“…Unlike previously discussed noble metals, tin is much more compatible with copper in many regards. Firstly, Cu and Sn exhibit rather high miscibility, ensuring that they can be combined in a true alloy in many different ratios [103]. Secondly, the redox potentials of Sn and Cu (−0.14 V and +0.34 V, respectively) make working with these two metals easier as galvanic replacement doesn't occur.…”

Section: Cu-snmentioning

confidence: 99%

Bimetallic copper-based nanowires and the means to create next-generation stable transparent electrodes

Križan,

Zimny,

Guyonnet

et al. 2023

Nano Ex.

View full text Add to dashboard Cite

Metallic nanowire percolating network is one of the promising alternatives of the conventional transparent conducting electrodes. Among the conductive metals, copper appears as a relevant alternative to develop electrodes in a more sustainable and economical way (abundance of the supplies, geo-political risks regarding the supplies, environmental impact, and cost). However, Cu nanowires suffer from high instability in air, and one of the ways to increase stability as well as to boost properties related to transparent electrodes is to combine the Cu with another metal, resulting in bimetallic nanowires. Even though the field of fabrication of nanoalloys has been advancing at a rapid pace in the last two decades, binary nanowires are difficult to produce due to a wide range of parameters that must be aligned in regard to metals that are being combined, such as surface energy of the bulk metal, atomic radii, crystal lattice matching, redox potentials, etc. In this review, we present the current research landscape in making Cu-based bimetallic nanowires for the development of metal nanowire networks with high oxidation resistance. This analysis allows identifying the most promising bimetallic materials for obtaining highly efficient, robust and cost-effective electrodes.

show abstract

Morphological and Mechanical Behaviour of Cu–Sn Alloys—A review

Cited by 38 publications

References 122 publications

Numerical simulation of mechanical behaviors and intergranular fracture of polycrystalline Nb₃Sn and superconducting filaments

Numerical simulation of mechanical behaviors and intergranular fracture of polycrystalline Nb₃Sn and superconducting filaments

New generation copper-based interconnection from nanoporous CuSn alloy film sintered at low temperatures

Bimetallic copper-based nanowires and the means to create next-generation stable transparent electrodes

Contact Info

Product

Resources

About

Morphological and Mechanical Behaviour of Cu–Sn Alloys—A review

Cited by 38 publications

References 122 publications

Numerical simulation of mechanical behaviors and intergranular fracture of polycrystalline Nb3Sn and superconducting filaments

Numerical simulation of mechanical behaviors and intergranular fracture of polycrystalline Nb3Sn and superconducting filaments

New generation copper-based interconnection from nanoporous CuSn alloy film sintered at low temperatures

Bimetallic copper-based nanowires and the means to create next-generation stable transparent electrodes

Contact Info

Product

Resources

About

Numerical simulation of mechanical behaviors and intergranular fracture of polycrystalline Nb₃Sn and superconducting filaments

Numerical simulation of mechanical behaviors and intergranular fracture of polycrystalline Nb₃Sn and superconducting filaments