More Moore meets More than Moore: Enabling healthcare applications

Brongersma, Sywert; Blauw, M. A.; Zevenbergen, Marcel A. G.; Karabacak, Devrez M.; Vitushinsky, R.; Dam, V.A.T.; Calama, Mercedes Crego; Vullers, Rudolf; Zeng, Zeng; Schaijk, R. van

doi:10.1002/pssc.201300182

Cited by 2 publications

(2 citation statements)

References 7 publications

(8 reference statements)

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“…For continuous sweat sensing and monitoring, a compact wearable device that can be worn directly on the skin and that continuously collects and analyzes the sweat would be an ideal solution (Brongersma et al 2014 ; Curto et al 2012 ; Schazmann et al 2010 ). This requires a microfluidic device that not only automatically absorbs the sweat, but also an integrated micropump that generates a continuous flow along sensors located within the device.…”

Section: Introductionmentioning

confidence: 99%

A microfluidic device based on an evaporation-driven micropump

Nie

Frijns

Mandamparambil

et al. 2015

Biomed Microdevices

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In this paper we introduce a microfluidic device ultimately to be applied as a wearable sweat sensor. We show proof-of-principle of the microfluidic functions of the device, namely fluid collection and continuous fluid flow pumping. A filter-paper based layer, that eventually will form the interface between the device and the skin, is used to collect the fluid (e.g., sweat) and enter this into the microfluidic device. A controllable evaporation driven pump is used to drive a continuous fluid flow through a microfluidic channel and over a sensing area. The key element of the pump is a micro-porous membrane mounted at the channel outlet, such that a pore array with a regular hexagonal arrangement is realized through which the fluid evaporates, which drives the flow within the channel. The system is completely fabricated on flexible polyethylene terephthalate (PET) foils, which can be the backbone material for flexible electronics applications, such that it is compatible with volume production approaches like Roll-to-Roll technology. The evaporation rate can be controlled by varying the outlet geometry and the temperature. The generated flows are analyzed experimentally using Particle Tracking Velocimetry (PTV). Typical results show that with 1 to 61 pores (diameter = 250 μm, pitch = 500 μm) flow rates of 7.3 × 10-3 to 1.2 × 10-1 μL/min are achieved. When the surface temperature is increased by 9.4 °C, the flow rate is increased by 130 %. The results are theoretically analyzed using an evaporation model that includes an evaporation correction factor. The theoretical and experimental results are in good agreement.Electronic supplementary materialThe online version of this article (doi:10.1007/s10544-015-9948-7) contains supplementary material, which is available to authorized users.

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Section: Introductionmentioning

confidence: 99%

A microfluidic device based on an evaporation-driven micropump

Nie

Frijns

Mandamparambil

et al. 2015

Biomed Microdevices

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“…We conclude by examining potential new and upcoming materials and the future direction for DB, CCL, and ES materials needed to both sustain Moore's Law 69 (i.e. "More Moore") and "More than Moore" 70,71 dimensional scaling.…”

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confidence: 99%

Dielectric Barrier, Etch Stop, and Metal Capping Materials for State of the Art and beyond Metal Interconnects

King

2014

ECS J. Solid State Sci. Technol.

131

115

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Over the past decade, the primary focus for improving the performance of nano-electronic metal interconnect structures has been to reduce the impact of resistance-capacitance (RC) delays via utilizing insulating dielectrics with ever lower values of dielectric permittivity. The integration and implementation of such low dielectric constant (i.e. low-k) materials has been fraught with numerous challenges. For intermetal and interlayer (ILD) low-k dielectrics, these challenges have been largely associated to integration with metal interconnect fabrication processes and well documented and reviewed in the literature. Although equally important, less attention has been given to other low-k dielectrics utilized in metal interconnect structures that are commonly referred to as low-k dielectric barriers (DB), etch stops (ES), and/or Cu capping layers (CCL). These materials present numerous challenges as well for integration into metal interconnect fabrication processes. However, they also have more stringent integrated functionality requirements relative to low-k ILD materials that serve only a basic purpose of electrically isolating adjacent metal lines. In this article, we review the integration challenges and associated integrated functionality requirements for low-k DB/ES/CCL materials with a focus on the current status and future direction needed for these materials to facilitate both Moore's law (i.e. More Moore) and More than Moore scaling.

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More Moore meets More than Moore: Enabling healthcare applications

Cited by 2 publications

References 7 publications

A microfluidic device based on an evaporation-driven micropump

A microfluidic device based on an evaporation-driven micropump

Dielectric Barrier, Etch Stop, and Metal Capping Materials for State of the Art and beyond Metal Interconnects

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