2006
DOI: 10.1016/s1369-7021(06)71539-5
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Moore's law: the future of Si microelectronics

Abstract: 2016-12-26T15:11:00

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Cited by 549 publications
(375 citation statements)
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“…284,285 However, conventional photolithography cannot achieve the high resolution especially when the feature size decrease is required. Two-photon photopolymerization appears to overcome such limitations, and three-dimensional nanostructures (3D) can be fabricated.…”
Section: New and Emerging Applicationsmentioning
confidence: 99%
“…284,285 However, conventional photolithography cannot achieve the high resolution especially when the feature size decrease is required. Two-photon photopolymerization appears to overcome such limitations, and three-dimensional nanostructures (3D) can be fabricated.…”
Section: New and Emerging Applicationsmentioning
confidence: 99%
“…The fabrication process of this all-solid-state micro-LIB was performed by the Si-compatible technologies and would be beneficial for the integration with other micro/nano electronic devices. However, this micro-sized anode may present poor electrochemical performance due to the volume expansion during the cycling and intrinsic low electronic/ionic conductivities in the Si electrode [77,78]. Therefore, an alternative and effective strategy is required to circumvent the corresponding negative effects.…”
Section: Fabrication Of 3d Micro-libs With Si As the Active Materialsmentioning
confidence: 99%
“…The miniaturization of integrated circuits down to sub-micrometric scales has been key in the developments of increasingly more advanced microelectronic devices which are ubiquitous in our daily life [1]. In recent years, however, the pace of miniaturization has considerably slowed down as the customary "top-down" fabrication methods are reaching the limit of their capability [2].…”
Section: Introductionmentioning
confidence: 99%