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TRANSDUCERS 2007 - 2007 International Solid-State Sensors, Actuators and Microsystems Conference 2007
DOI: 10.1109/sensor.2007.4300217
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Monolithic RF MEMS Probe Array System using RF MEMS SP3T Switches for Permittivity Measurement

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Cited by 1 publication
(2 citation statements)
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“…Every sample is isolated subsequent to the release process and photoresist coating as a passivation layer for the dicing process. RF MEMS transmission lines (3 µm thickness) are fabricated on a quartz substrate and have a semi-coaxial-like structure composed of a BCB layer (20 µm thickness) [5,6,[9][10][11]. Each fabricated component is shown in figure 5(a) and the assembled figure including the jig and SMA connector is shown in figure 5(b).…”
Section: Fabrication Resultsmentioning
confidence: 99%
See 1 more Smart Citation
“…Every sample is isolated subsequent to the release process and photoresist coating as a passivation layer for the dicing process. RF MEMS transmission lines (3 µm thickness) are fabricated on a quartz substrate and have a semi-coaxial-like structure composed of a BCB layer (20 µm thickness) [5,6,[9][10][11]. Each fabricated component is shown in figure 5(a) and the assembled figure including the jig and SMA connector is shown in figure 5(b).…”
Section: Fabrication Resultsmentioning
confidence: 99%
“…We used cyclotene 4026-46. The thickness of the dielectric layer was determined as 20 µm because the maximum thickness of cyclotene 4026-46 in a single coating is 20 µm [11]. The width of the signal and gap is designed to match to 50 , and full-wave simulation was performed using a commercial EM simulator, HFSS (ANSOFT).…”
Section: Micromachined Transmission Line With Planar-type Aperturementioning
confidence: 99%