2001
DOI: 10.1016/s0026-2714(01)00123-8
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Monitoring of power dissipated in microelectronic structures

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Cited by 3 publications
(5 citation statements)
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“…Nevertheless, as long as we use data processing by means of electron devices, we have to consider energy losses. Due to the high power dissipations in present-day electronics, cooling and temperature management are and will be an important topic [2][3][4][5][6][7][8][9][10][11][12][13]. Although fan cooling is the most widely used, other alternatives such as natural convection, liquid cooling, heat pipes, new materials, Peltier heat pumps, harvesting, etc.…”
Section: Introductionmentioning
confidence: 99%
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“…Nevertheless, as long as we use data processing by means of electron devices, we have to consider energy losses. Due to the high power dissipations in present-day electronics, cooling and temperature management are and will be an important topic [2][3][4][5][6][7][8][9][10][11][12][13]. Although fan cooling is the most widely used, other alternatives such as natural convection, liquid cooling, heat pipes, new materials, Peltier heat pumps, harvesting, etc.…”
Section: Introductionmentioning
confidence: 99%
“…The main challenge for these high-performance devices is to ensure proper working temperature to reduce the interior energy density of the semiconductor structure. Decreasing the semiconductor structure temperature involves increasing its reliability and working efficiency [10,11,21,25].…”
Section: Introductionmentioning
confidence: 99%
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“…In literature (Howard et al, 2011;Lee et al, 2012;Jacquet et al, 2014), there is a focus on a specific device for a specific technology. Power estimation, reduction and monitoring are presented in papers (Dziurdzia and Kos, 2001;Brzozowski and Kos, 2005.…”
Section: Introductionmentioning
confidence: 99%