“…In the SRPD step under the condition with ion flux, accelerated ions and radicals containing arsenic atoms may impinge on the natural oxide, and arsenic atoms may diffuse through the natural oxide into the silicon by an ion-assisted mechanism such as the knock-on mechanism. 13,14) Then the arsenic atoms in silicon may be activated by the subsequent spike annealing at 1025 C. In contrast under the condition without ion flux, for example, at the fin sidewall beneath the OHM, only radicals may impinge on the natural oxide and arsenic atoms may not diffuse into the silicon. Figure 2(c) shows the SR profiles of path A and path B with the OHM.…”