1999
DOI: 10.1016/s0022-0248(98)01395-5
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Molecular beam epitaxy (MBE) in situ high-temperature annealing of HgCdTe

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Cited by 21 publications
(8 citation statements)
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“…[6][7][8][9][10][11] Previous work has mainly focused on the extent to which dislocation density can be reduced via TCA. Using TCA, an etch pit density (EPD) saturation limit of $1 9 10 6 cm À2 can be consistently achieved by applying appropriate annealing conditions.…”
Section: Introductionmentioning
confidence: 99%
“…[6][7][8][9][10][11] Previous work has mainly focused on the extent to which dislocation density can be reduced via TCA. Using TCA, an etch pit density (EPD) saturation limit of $1 9 10 6 cm À2 can be consistently achieved by applying appropriate annealing conditions.…”
Section: Introductionmentioning
confidence: 99%
“…When the oxide layer is removed (the RHEED pattern is appeared) the PSCT temperature should be immediately decreases to 300°C and start with the CdTe buffer growth. The first was the layers of ZnTe (about 0.1 μm) as a small crystal lattice mismatch with respect to GaAs than the CdTe (3.5μm layer is applied [9] ).…”
Section: Mbe Grownmentioning
confidence: 99%
“…It has been reported that rapid thermal annealing (RTA) under N 2 vapor pressure has great effects in the dislocation reduction of HgCdTe/CdTe epilayers [8] , previously. In situ thermal annealing (TA) is also an effective way to reduce dislocation density [9] . However, it was difficult to obtain good morphology of HgCdTe epilayers at high annealing temperature for a long holding time.…”
Section: Introductionmentioning
confidence: 99%