Moisture Transport Through Housing Materials Enclosing Critical Automotive Electronics

Roman, Artur; Wu, Bulong; Han, Bongtae; Reinacher, Gesche Mareike; Yousef, Susan Galal

doi:10.1109/tcpmt.2020.2977111

Cited by 6 publications

(1 citation statement)

References 39 publications

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“…Most of the studies of humidity and temperature predictions were carried out on electronics enclosures [8,12,15]. One of the previous study [16] considered the humidity and temperature predictions in the two connected enclosures which were made of glass.…”

Section: Introductionmentioning

confidence: 99%

Numerical Modelling of Moisture Transport Between Two Enclosures Connected by a Tube

Staliulionis¹,

Miliauskas²,

MOHANTY³

et al. 2022

mech

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The electronics is protected using plastic or metallic enclosures. Although, the electronics is protected by the enclosures from the surrounding environment, the moisture can still enter the enclosure via gasket, plastic enclosure walls, cable feedthroughs. The moisture existing inside enclosure may condense on PCBA or components due to a temperature changes or different temperature levels and can lead to a moisture-related failures. The temperature in the enclosure is also very dependent on the location and the heating of electronic components. Furthermore, the electronics can be mounted nearby to other heating or cooling components in the complex mechanical systems, such as water pump or water meter. The paper concerns the complex transient heat and mass transfer processes between two connected enclosures with one being warm and another cold. The objective of the paper is to develop an in-house code based on the RC approach for predicting and studying the temperature and moisture behaviour inside two connected enclosures. The developed RC model combines one-dimensional description and lumped analysis for heat and mass transport. The modelling of temperature and moisture response is carried out under non-isothermal B3 STANAG ambient conditions. Moreover, the effect of different material of warm enclosure and the heating are considered.

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