2015
DOI: 10.1063/1.4921670
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Modulations of the plasma uniformity by low frequency sources in a large-area dual frequency inductively coupled plasma based on fluid simulations

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Cited by 16 publications
(6 citation statements)
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“…This modeling platform has been used to simulation the ICP and capacitive coupled plasma (CCP) discharges. [22][23][24][25][26][27][28] The fluid model of the MAPS-ICP employed in this work is similar to that described in Refs. [24]- [26].…”
Section: Description Of the Fluid Modelmentioning
confidence: 99%
See 1 more Smart Citation
“…This modeling platform has been used to simulation the ICP and capacitive coupled plasma (CCP) discharges. [22][23][24][25][26][27][28] The fluid model of the MAPS-ICP employed in this work is similar to that described in Refs. [24]- [26].…”
Section: Description Of the Fluid Modelmentioning
confidence: 99%
“…[22][23][24][25][26][27][28] The fluid model of the MAPS-ICP employed in this work is similar to that described in Refs. [24]- [26]. Therefore, only a brief description is included here.…”
Section: Description Of the Fluid Modelmentioning
confidence: 99%
“…Moreover, a two-dimensional (2D) selfconsistent fluid model suggested that the addition of lowfrequency power could largely improve the plasma uniformity in a dual-frequency inductively coupled plasma (ICP). [10] Besides, some special geometric configurations of plasma source can also improve the plasma uniformity. For example, Overzet et al [11] found that a Faraday shield can improve the plasma azimuthal uniformity, and Brcka et al [12] used an integrated planar multi-coil to improve plasma radial uniformity in an ICP source.…”
Section: Introductionmentioning
confidence: 99%
“…Because the distribution of plasma characteristics is vital for controlling the process of semiconductor etching, it is of great interest to elucidate the effect of bias on the plasma distributions. Therefore, in this study, the multi-physics analysis for plasma sources-ICP (MAPS-ICP) solver [17][18][19][20][21] composed of a fluid module and a sheath module [22,23] is employed to investigate the effects of single-frequency and dual-frequency bias on the plasma characteristics at different values of ICP source power. Our results provide a useful insight into the effect of source power, which can be used for optimizing the plasma processing techniques.…”
Section: Introductionmentioning
confidence: 99%