Modular power converter integration based on non-conventional power switch assembly and interconnects

2016 6th Electronic System-Integration Technology Conference (ESTC)

Castellazzi

2016

The recent research exercises have targeted the transfer of the sandwich package benefits to application bespoke switch design, including flip-chip and device stacking topology [1]. This work presents the development of a highly integrated power switch, based on 70μm thin IGBTs and diodes rated at 600V/200A along with customized connectors to interface quickly the gate driver, the input, and the load side PCBs. This modular system has been designed with the aim to achieve high performance including the modularity and maintainability of power converter that can be worse in a system integrated into a single package. IntroductionThis paper presents the reliable integration of a Halfbridge switch based on latest generation 70um thin devices rated at 600V-200A IGBTs and diodes. The use of thin devices in the switch implementation offers not only superior electrical but also thermal performance, as compared with thicker ones, and brings along increased power density figures [2]. In particular, it advances the state-of-the-art as regards a recently presented packaging concept, which aims the optimisation from the application point of view [3]. As pointed out in [4] and illustrated in Fig. 1 for improving switching performance, packaging and integration design should aim at integrating the positive and negative switching cells, that is the high-side transistor/low-side diode and the low-side transistor/highside diode pairs respectively.

Section: Half-bridge Switch System Assemblymentioning

confidence: 72%

Section: Half-bridge Switch Model and Simulationmentioning

confidence: 99%

Modular plug-in high performance integrated single-phase inverter

2016 6th Electronic System-Integration Technology Conference (ESTC)

Castellazzi

2016

“…1c show an exploded view of the stacked HBS and a picture of it, respectively. More details of the HBS technology can be found in [8,9]. This novel assembly is designed for high frequency plug in connectors, allowing optimization of performance, reliability and availability of the power system by means the following features.…”

Section: The Double Flat Power Switchmentioning

confidence: 99%

“…In a previous work [8,9] the authors developed a highly integrated double power switch, in half bridge configuration, based on 70m thin IGBTs and diodes rated at 600V/200A, on advanced ceramic substrate technology, featuring double-etched patterned copper tracks for a fully bond-wire-less double-sided cooling. Such an assembly could be suitable for applications also with SiC devices, due to its low parasitic inductance, low thermal resistance, and high strength.…”

Section: The Double Flat Power Switchmentioning

confidence: 99%

Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability

Cova

Delmonte

Microelectronics Reliability

et al. 2016

Self Cite

(2016) Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability. Microelectronics Reliability, 64 . pp. 507-512. ISSN 0026-2714 Access from the University of Nottingham repository: http://eprints.nottingham.ac.uk/43872/1/Thermal%20design%20optimization%20of%20novel %20modular%20power%20converter%20assembly%20enabling%20higher%20performance %20reliability%20and%20availability.pdf The version presented here may differ from the published version or from the version of record. If you wish to cite this item you are advised to consult the publisher's version. Please see the repository url above for details on accessing the published version and note that access may require a subscription. AbstractAn alternative integration scheme for a half-bridge switch using 70 m thin Si IGBTs and diodes is presented. This flat switch, which is designed for high-frequency application with high power density, exhibits high strength, high toughness, low parasitic inductance and high thermal conductivity. Such a novel assembly approach is suitable to optimize performance, reliability and availability of the power system in which it is used. The paper focuses on the thermal performance of this assembly at normal and extreme operating conditions, studied by means of FEM thermofluidynamic simulations of the module integrated with connectors and liquid cooler, and thermal measurement performed on an early prototype. Improved solutions are also investigated by the FE model.

“…Here, the switch is implemented in an innovative sandwich type assembly, where each IGBT-diode pair is soldered backside down on separate substrates [7]: as compared with previously proposed approaches (see [8], for example), this arrangement offers the possibility to keep the interconnection loops and the corresponding stray inductance between TH-DL and between TL-DH at a minimum, while ensuring that all devices can be efficiently cooled via their preferential heattransfer path, that is the backside. This way, while double sided cooling is still achieved, the thermal performance of the assembly is fully symmetrical.…”

Section: A Modulementioning

confidence: 99%

Modular Assembly of a Single-Phase Inverter Based on Integrated Functional Blocks

Castellazzi

IEEE Trans. on Ind. Applicat.

Delmonte

et al. 2017

Abstract--This paper presents an original modular plug-in type assembly approach for a single phase-inverter. The main focus here is, indicatively, on the power range 1-20 kW, but the methodology can be transferred to higher power levels, too. At the core of the inverter lies a power-dense double-sided-cooled halfbridge power switch architecture with integrated cooler, which is interconnected to filter elements, gate-driver and control circuitry by means of compact flat connectors. The integration exercise targets, on the one hand, the optimization of the power switch performance and reliability, as well as the reduction of circuit parasitic elements; on the other, the production of a system compatible with maintenance and repairing, featuring minimized impact of single component failure on the system maintenance and repair cost and thus on its availability. Preliminary experimental tests demonstrate the nominal functionality of the inverter.