Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability

Cova, Paolo; Delmonte, Nicola; Solomon, Adane Kassa; Castellazzi, Alberto

doi:10.1016/j.microrel.2016.07.019

Cited by 9 publications

(5 citation statements)

References 8 publications

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“…Preliminary experimental results show correct operation of the system. More quantitative details of electro-thermal performance are presented in [19,20]. Overall, the proposed approach is transferable to upcoming wide-band-gap device technology, as it is compatible with higher heat-generation rates and higher switching frequencies than the more traditional assembly solutions.…”

Section: Discussionmentioning

confidence: 99%

Modular Assembly of a Single-Phase Inverter Based on Integrated Functional Blocks

Castellazzi

Solomon

Delmonte

et al. 2017

IEEE Trans. on Ind. Applicat.

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Abstract--This paper presents an original modular plug-in type assembly approach for a single phase-inverter. The main focus here is, indicatively, on the power range 1-20 kW, but the methodology can be transferred to higher power levels, too. At the core of the inverter lies a power-dense double-sided-cooled halfbridge power switch architecture with integrated cooler, which is interconnected to filter elements, gate-driver and control circuitry by means of compact flat connectors. The integration exercise targets, on the one hand, the optimization of the power switch performance and reliability, as well as the reduction of circuit parasitic elements; on the other, the production of a system compatible with maintenance and repairing, featuring minimized impact of single component failure on the system maintenance and repair cost and thus on its availability. Preliminary experimental tests demonstrate the nominal functionality of the inverter.

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Section: Discussionmentioning

confidence: 99%

Modular Assembly of a Single-Phase Inverter Based on Integrated Functional Blocks

Castellazzi

Solomon

Delmonte

et al. 2017

IEEE Trans. on Ind. Applicat.

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“…To investigate the influence of various active cooling technologies such as air and liquid (single and two-phase) cooling, a platefin type heat sink consisting of rectangular channels with crosssectional dimensions: 2.55 Â 21.88 mm and 1.1 mm thick fins was attached to the bottom of the baseplate; this heat sink is identical to the one chosen in a recent study [11]. To reduce the computational cost, the entire domain was divided into smaller sets of self-replicating, symmetrical entities.…”

Section: Description Of Simulation Methodologymentioning

confidence: 99%

“…It is challenging to obtain analytical solutions to the three-dimensional Poisson's equation to arrive at the temperature map for a complex commercial package. Therefore, numerous studies have analyzed the influence of cooling technologies and package designs on the thermal performance using either a thermal resistance network analogy (Foster or Cauer network) or via 3D simulations [9][10][11]. Thermal resistance circuits can capture heat spreading within different layers, and can be used to model slightly complicated geometries without resorting to full-scale threedimensional (3D) simulations.…”

Section: Introductionmentioning

confidence: 99%

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Acharya

Lokanathan

Ouroua

et al. 2021

Journal of Electronic Packaging

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Machine learning (ML)-based predictive techniques are used in conjunction with a game-theoretic approach to predict the thermal behavior of a power electronics package and study the relative influence of encapsulation material properties and thermal management in influencing hotspot temperatures. Parametric steady-state and transient thermal simulations are conducted for a commercially available 1.2 kV/444 A SiC half-bridge module. An extensive databank of 2592 (steady-state) and 1200 (transient) data points generated via numerical simulations is used to train and evaluate the performance of three ML algorithms (random forest, support vector machine and neural network) in modeling the thermal behavior. The parameter space includes the thermal conductivities of the encapsulant, baseplate, heat sink and cooling conditions deployed at the sink; the parametric space covers a variety of materials and cooling scenarios. Excellent prediction accuracies with R2 values > 99.5% are obtained for the algorithms. SHAP (Shapley Additive exPlanations) dependence plots are used to quantify the relative impact of device and heat sink parameters on junction temperatures. We observe that while heatsink cooling conditions significantly influence the steady-state junction temperature, their contribution in determining the junction temperature in dynamic mode is diminished. Using ML-SHAP models, we quantify the impact of emerging polymeric nanocomposites (with high conductivities and diffusivities) on hotspot temperature reduction, with the device operating in static and dynamic modes. Overall, this study highlights the attractiveness of ML-based approaches for thermal design, and provides a framework for setting targets for future encapsulation materials.

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“…The first important issue, was to modify the electrical connection with the die. The same flat-pack technology presented in [12,13] was considered in order to obtain a wireless module. Fig.…”

Section: Design For Reliability Improvementmentioning

confidence: 99%

Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch

Cova

Aliyu

Castellazzi

et al. 2017

Microelectronics Reliability

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The aim of this work is the thermal design of a modular direct liquid cooled package for 1200V-35A SiC power MOSFETs, in order to take full advantage of the high power density and high frequency performance of these devices, in the development of a modular integrated solution for power converters. An accurate electro-thermal fluid dynamic model is set up and validated by thermal characterization on a prototype; numerical models have been used to study the internal temperature distribution and to propose further optimization.

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Thermal design optimization of novel modular power converter assembly enabling higher performance, reliability and availability

Cited by 9 publications

References 8 publications

Modular Assembly of a Single-Phase Inverter Based on Integrated Functional Blocks

Modular Assembly of a Single-Phase Inverter Based on Integrated Functional Blocks

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Thermal design and characterization of a modular integrated liquid cooled 1200 V-35 A SiC MOSFET bi-directional switch

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