“…Moreover, Stress-migration (SM) is due to the development of large tensile and compressive stress region at cathode and anode respectively as a combined consequence of the atomic migration and also due to the different thermal expansion coefficients of a narrow metal line and passivation or inter-metal dielectric material [13]. Hydro-static stress is proved to be the main driving force for void nucleation; regions with the most concentrated hydrostatic tensile stress are assumed to be the most probable sites for void nucleation [14,15].…”
“…Moreover, Stress-migration (SM) is due to the development of large tensile and compressive stress region at cathode and anode respectively as a combined consequence of the atomic migration and also due to the different thermal expansion coefficients of a narrow metal line and passivation or inter-metal dielectric material [13]. Hydro-static stress is proved to be the main driving force for void nucleation; regions with the most concentrated hydrostatic tensile stress are assumed to be the most probable sites for void nucleation [14,15].…”
“…Physical failure modeling is used extensively within simulation during detailed design and development. Mathewson et al [101] provided a review of simulation tools used within the design process for predictive inference as well as for supporting optimal design decisions. The majority of these models make extensive use of component level physical models which are adjusted by empirical data for calibration.…”
This paper reviews the role of expert judgement to support reliability
assessments within the systems engineering design process. Generic design
processes are described to give the context and a discussion is given about the
nature of the reliability assessments required in the different systems
engineering phases. It is argued that, as far as meeting reliability
requirements is concerned, the whole design process is more akin to a
statistical control process than to a straightforward statistical problem of
assessing an unknown distribution. This leads to features of the expert
judgement problem in the design context which are substantially different from
those seen, for example, in risk assessment. In particular, the role of experts
in problem structuring and in developing failure mitigation options is much
more prominent, and there is a need to take into account the reliability
potential for future mitigation measures downstream in the system life cycle.
An overview is given of the stakeholders typically involved in large scale
systems engineering design projects, and this is used to argue the need for
methods that expose potential judgemental biases in order to generate analyses
that can be said to provide rational consensus about uncertainties. Finally, a
number of key points are developed with the aim of moving toward a framework
that provides a holistic method for tracking reliability assessment through the
design process.Comment: This paper commented in: [arXiv:0708.0285], [arXiv:0708.0287],
[arXiv:0708.0288]. Rejoinder in [arXiv:0708.0293]. Published at
http://dx.doi.org/10.1214/088342306000000510 in the Statistical Science
(http://www.imstat.org/sts/) by the Institute of Mathematical Statistics
(http://www.imstat.org
“…The C.A1OS behavioural model is built using the AIJOSFET basic electrical equations writteni in I UD-L-AAIS language. This behavioural model integrates the evolution of transistor characteristics as expressed by equationi (1). Several parameters can be investigated as mobility, drain access resistance of ALOSFET.…”
Section: B Bias Coniditions Analvs1imentioning
confidence: 99%
“…The concept of Design For Reliability (DFR) is a nexx challenge. Design For Reliabilit' strategxy is based on reliabilitx simulationi in the design flow that aims to predict the impact of phy sical phenomena from A1JOSFET to IC electrical characteristics over the operating time [1] [2]. Consequentlyreliability simulators need to take into account reliabilitv models of transistor.…”
This paper presents a method to develop stressed behavioral models of MOSFET and an analogue block : Operational Transconductance Amplifier: Our approach is based on an experimental case study of CA1OS technology ageing That implies experimental tests to ev-aluate electrical ageing effects on MOSFET. The expeIrimental data set is used to build a fMOSFET device ageing I IDL-AM1S model that is included in an OTA I HDIL-AM1S model to define a stressed behaivioral model of the amplifier.
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