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1999
DOI: 10.1016/s0167-9317(99)00432-3
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Modelling and simulation of reliability for design

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Cited by 14 publications
(5 citation statements)
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“…Moreover, Stress-migration (SM) is due to the development of large tensile and compressive stress region at cathode and anode respectively as a combined consequence of the atomic migration and also due to the different thermal expansion coefficients of a narrow metal line and passivation or inter-metal dielectric material [13]. Hydro-static stress is proved to be the main driving force for void nucleation; regions with the most concentrated hydrostatic tensile stress are assumed to be the most probable sites for void nucleation [14,15].…”
Section: Previous Studies Reviewmentioning
confidence: 99%
“…Moreover, Stress-migration (SM) is due to the development of large tensile and compressive stress region at cathode and anode respectively as a combined consequence of the atomic migration and also due to the different thermal expansion coefficients of a narrow metal line and passivation or inter-metal dielectric material [13]. Hydro-static stress is proved to be the main driving force for void nucleation; regions with the most concentrated hydrostatic tensile stress are assumed to be the most probable sites for void nucleation [14,15].…”
Section: Previous Studies Reviewmentioning
confidence: 99%
“…Physical failure modeling is used extensively within simulation during detailed design and development. Mathewson et al [101] provided a review of simulation tools used within the design process for predictive inference as well as for supporting optimal design decisions. The majority of these models make extensive use of component level physical models which are adjusted by empirical data for calibration.…”
Section: Reliability Modelsmentioning
confidence: 99%
“…The C.A1OS behavioural model is built using the AIJOSFET basic electrical equations writteni in I UD-L-AAIS language. This behavioural model integrates the evolution of transistor characteristics as expressed by equationi (1). Several parameters can be investigated as mobility, drain access resistance of ALOSFET.…”
Section: B Bias Coniditions Analvs1imentioning
confidence: 99%
“…The concept of Design For Reliability (DFR) is a nexx challenge. Design For Reliabilit' strategxy is based on reliabilitx simulationi in the design flow that aims to predict the impact of phy sical phenomena from A1JOSFET to IC electrical characteristics over the operating time [1] [2]. Consequentlyreliability simulators need to take into account reliabilitv models of transistor.…”
Section: Introductionmentioning
confidence: 99%