Progress in the Development of an Electro-Migration Modelling Methodology

Zhu, Xiaoxin; Kotadia, Hiren; Xu, Sha; Lu, Hua; Mannan, Samjid H.; Bailey, C.; Chan, Yin-Ching

doi:10.5151/meceng-wccm2012-18799

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“…Preliminary work on a 3D Blech structure showed that the simulated atomic flux divergence is consistent with experimental results Ref. (22).…”

Section: Numerical Simulation Methodologysupporting

confidence: 78%

Modeling Electromigration for Microelectronics Design

Xiao

Kotadia

et al. 2013

JCST

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Computer simulation of electromigration (EM) in microelectronics devices has been reviewed and a multi-physics numerical simulation method has been proposed and developed so that the electric current, temperature, stress can be solved simultaneously and the vacancy concentration can be predicted in a seamless framework. The design considerations for resisting EM is also discussed in this work and a shunt structure for solder joint pad is proposed and its potential for the reduction of EM risk is demonstrated.

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“…Preliminary work on a 3D Blech structure showed that the simulated atomic flux divergence is consistent with experimental results Ref. (22).…”

Section: Numerical Simulation Methodologysupporting

confidence: 78%