2014
DOI: 10.1007/s00466-014-1005-5
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Modelling and simulation of adhesive curing processes in bonded piezo metal composites

Abstract: This work deals with the modelling and simulation of curing phenomena in adhesively bonded piezo metal composites which consist of an adhesive layer with integrated piezoelectric module and two surrounding metal sheet layers. In a first step, a general modelling framework is proposed which is able to represent curing phenomena in polymers at finite strains. Based on this formulation, a concretized model is deduced for the simulation of curing in one specific epoxy based adhesive. Here, appropriate material fun… Show more

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Cited by 28 publications
(29 citation statements)
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“…the progress of the curing process, see for example [3]). Moreover, θ > 0 is the temperature and q ∈ [0, 1] is the degree of cure (i.e.…”
Section: Preservation Of a Constant Initial Volumementioning
confidence: 99%
See 2 more Smart Citations
“…the progress of the curing process, see for example [3]). Moreover, θ > 0 is the temperature and q ∈ [0, 1] is the degree of cure (i.e.…”
Section: Preservation Of a Constant Initial Volumementioning
confidence: 99%
“…Moreover, θ > 0 is the temperature and q ∈ [0, 1] is the degree of cure (i.e. the progress of the curing process, see for example [3]). The symbolsθ andq represent reference values for which the material parameters have been defined and for which the volume ratio yields ϕ θc (θ,q) = 1.…”
Section: Preservation Of a Constant Initial Volumementioning
confidence: 99%
See 1 more Smart Citation
“…To this end, the viscoelastic material model including the curing process was implemented by the help of user-subroutines. Here, a newly developed algorithm assures a constant initial mesh volume at arbitrary distributed values for the temperature and the degree of cure [5]. During the curing simulations, the temperature, the degree of cure as well as stresses and deformations are monitored and evaluated.…”
Section: Modelling and Computation Frameworkmentioning
confidence: 99%
“…Based on the evaluation of the laws of thermodynamics, a continuum mechanical material model for the adhesive is deduced. It is based on the multiplicative decomposition of the deformation gradient into a thermochemical and a mechanical part in first place and into a volume changing and volume preserving part of the latter [2]. Thermochemical processes are assumed to be isotropic and follow an exponential model identified by the measurements based on DSC and Archimedes principle [2,4].…”
Section: Experimental Characterisationmentioning
confidence: 99%