2017
DOI: 10.1088/1757-899x/204/1/012017
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Modelling and Optimization of Copper Electroplating Adhesion Strength

Abstract: Abstract. In this paper, Response surface methodology (RSM) was utilized to design the experiments at the settings of CuSO 4 and H 2 SO 4 concentrations and current densities. It also used for modelling and optimize the parameters on the adhesion strength of austenitic stainless steel substrate. The adhesion strength was investigated by the Teer ST-30 tester, and the structure of the samples investigated by using scanning electron microscopy (SEM). The modelling approach adopted in the present investigation ca… Show more

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Cited by 4 publications
(4 citation statements)
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“…Table 3 shows that the cathodic current e ciency was signi cantly affected by glycerol linearly, amperage linearly and quadratically, by the glycerol with time interaction and amperage with time interaction, within a 95% con dence interval. The determination coe cient (R²) showed a value of 0.9279, which is in considerable agreement with the adjusted R² of 0.84685, showing a difference of less than 0.2, so that the quadratic model applied is the most appropriate [20].…”
Section: Copper Electrodeposition Statistical Modelingsupporting
confidence: 67%
See 1 more Smart Citation
“…Table 3 shows that the cathodic current e ciency was signi cantly affected by glycerol linearly, amperage linearly and quadratically, by the glycerol with time interaction and amperage with time interaction, within a 95% con dence interval. The determination coe cient (R²) showed a value of 0.9279, which is in considerable agreement with the adjusted R² of 0.84685, showing a difference of less than 0.2, so that the quadratic model applied is the most appropriate [20].…”
Section: Copper Electrodeposition Statistical Modelingsupporting
confidence: 67%
“…4(c), grains appear, indicating the copper electrodeposition, but they are larger, showing that there is a variation in the process due to the cyanide use. The smaller grains show better adhesion of the cyanide-free copper electroplating [20]. Larger grains can facilitate the removal of the electroplated layer through friction.…”
Section: Copper Electrodeposition Lm Analysismentioning
confidence: 99%
“…Further, thiol can be coated on any metal used for a condenser, with an additional copper layer using electroplating, , physical vapor deposition, , etc. Since copper has very high thermal conductivity (401 W m –1 K –1 ), such an additional layer should hardly affect the overall heat-transfer efficiency.…”
Section: Resultsmentioning
confidence: 99%
“…It was employed in this study to investigate the effects of temperature and soaking time on the hardness of the lowcarbon steel. ANOVA is a useful tool in determining the order of importance of the influencing parameters on the response, which helps in validating the results obtained through the Taguchi method 19 .…”
Section: Analysis Of Variance (Anova)mentioning
confidence: 99%