Modelling and analysis of the stress distribution in a multi-thin film system Pt/USG/Si

Yao, Weizhen; Roqueta, Fabrice; Craveur, Jean-Charles; Belhenini, Soufyane; Gardes, P.; Tougui, Abdellah

doi:10.1088/2053-1591/aaba4b

Cited by 13 publications

(15 citation statements)

References 23 publications

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“…Finally, the direct height of front and backside is collected by computers through cameras. And the detailed test process is similar to that MX 203 [16].…”

Section: Resultsmentioning

confidence: 99%

An effective solution to optimize the saddle-shape warpage in 3D IC applications by patterning laser treatment

Fan¹,

Xia²,

Xie³

et al. 2023

Semicond. Sci. Technol.

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The asymmetric saddle-shape warpage is one of the hardest limitations on the development of three-dimensional integrated circuits (3D ICs) as the vertical integration increases. To improve the product yield, an effective method for saddle-shape warpage reduction in 3D IC production by backside patterning laser annealing treatment with a multilayer structure is investigated in this work. The reduction of saddle–shaped warpage by patterning laser treatment is the first time in 3D NAND array wafer application and through simulations and experiments, the laser annealing pattern is determined. In addition, the materials of the multilayer structure are selected as amorphous Al2O3 and TiN according to experiments and theoretical analysis. As a result, a conformal 47.8 µm optimization of the saddle-shape warpage is successfully reached in a control wafer test by patterning laser annealing treatment.

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“…Finally, the direct height of front and backside is collected by computers through cameras. And the detailed test process is similar to that MX 203 [16].…”

Section: Resultsmentioning

confidence: 99%

An effective solution to optimize the saddle-shape warpage in 3D IC applications by patterning laser treatment

Fan¹,

Xia²,

Xie³

et al. 2023

Semicond. Sci. Technol.

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show abstract

“…The numerical estimate of the warpage corresponds to the relative vertical displacement of the wafer. To the validation of our numerical model, we compared the numerically obtained warpage with that experimentally measured by Yao et al (2018). Experimental deflection was measured at 68 mm from the center of the wafer.…”

Section: Validation Of the Numerical Modelmentioning

confidence: 99%

Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications

Fatmi

Belhenini

Tougui

2023

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Purpose The aim of this study is to make a contribution towards reducing the deflections of silicon wafers. The deformation of silicon wafers used in the manufacture of electronic micro-components is one of the most common problems encountered by industrialists during manufacturing. Stack warping is typically produced during the process of depositing thin layers on a substrate. This is due to the thermal-mechanical stresses caused by the difference between the thermal expansion coefficients of the materials. Reducing wafer deformation is essential to increase reliability and improve quality. In this paper, the authors propose an approach based on minimal geometrical modifications to reduce the deformation of a silicon wafer coated with two thin layers. Numerical finite element models have been developed to evaluate the impact of geometrical modifications on warping amplitude. Finite element models have been validated compared with experimental models. The results obtained are encouraging and clearly show a considerable reduction in wafer deformation. Design/methodology/approach Reducing wafer deformation is essential to increase reliability and improve quality. In this paper, the authors propose an approach based on minimal geometrical modifications to reduce the deformation of a silicon wafer coated with two thin layers. Numerical finite element models have been developed to evaluate the impact of geometrical modifications on warping amplitude. Finite element models have been validated compared with experimental models. Findings The results obtained are encouraging and clearly show a considerable reduction in wafer deformation. Originality/value This paper describes the influence of geometric modification on wafer deformation. The work show also the cruciality of stress reduction in the purpose to obtain less wafer deformation.

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“…Hence, the structure was transferred to a typical three-layer model. The Stoney equation is widely used to calculate the thermal warpage for multilayer structures [25][26][27][28][29][30][31][32]. When a sample's warpage (w) is much smaller than its dimensions [31], the warpage can be expressed as…”

Section: Appendix Amentioning

confidence: 99%

Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer

Liu

et al. 2020

Sensors

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Capacitive MEMS accelerometers with area-variable periodic-electrode displacement transducers found wide applications in disaster monitoring, resource exploration and inertial navigation. The bonding-induced warpage, due to the difference in the coefficients of thermal expansion of the bonded slices, has a negative influence on the precise control of the interelectrode spacing that is essential to the sensitivity of accelerometers. In this work, we propose the theory, simulation and experiment of a method that can alleviate both the stress and the warpage by applying different bonding temperature on the bonded slices. A quasi-zero warpage is achieved experimentally, proving the feasibility of the method. As a benefit of the flat surface, the spacing of the capacitive displacement transducer can be precisely controlled, improving the self-noise of the accelerometer to 6 ng/√Hz @0.07 Hz, which is about two times lower than that of the accelerometer using a uniform-temperature bonding process.

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Modelling and analysis of the stress distribution in a multi-thin film system Pt/USG/Si

Cited by 13 publications

References 23 publications

An effective solution to optimize the saddle-shape warpage in 3D IC applications by patterning laser treatment

An effective solution to optimize the saddle-shape warpage in 3D IC applications by patterning laser treatment

Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications

Temperature Gradient Method for Alleviating Bonding-Induced Warpage in a High-Precision Capacitive MEMS Accelerometer

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