Modeling the thermal behavior of a surface-micromachined linear-displacement thermomechanical microactuator

Lott, Christian D.; McLain, Timothy W.; Harb, John N.; Howell, Larry L.

doi:10.1016/s0924-4247(02)00202-9

Cited by 182 publications

(146 citation statements)

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“…Work presented in this current paper was undertaken to further validate the effect of conduction into the ambient; with a combination of reduced pressure and/or different thermal conductivity ambients, the importance of this heat loss mechanism was expected to become apparent. Modelling work reported previously [15] for a thermal actuator of a very different design has shown a reduced drive current in a vacuum ambient can give the same deflection as the current needed in air (ratio ~1:3.6), although this was not verified experimentally.…”

mentioning

confidence: 86%

Modelling and experimental verification of heat dissipation mechanisms in an SU-8 electrothermal microgripper

Solano

Merrell

Gallant

et al. 2014

Microelectronic Engineering

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NOTICE: this is the author's version of a work that was accepted for publication in Microelectronic Engineering. Changes resulting from the publishing process, such as peer review, editing, corrections, structural formatting, and other quality control mechanisms may not be reected in this document. Changes may have been made to this work since it was submitted for publication. A denitive version was subsequently published in Microelectronic Engineering, 124, 25 July 2014, 10.1016/j.mee.2014.06.002. Additional information:Use policyThe full-text may be used and/or reproduced, and given to third parties in any format or medium, without prior permission or charge, for personal research or study, educational, or not-for-prot purposes provided that:• a full bibliographic reference is made to the original source • a link is made to the metadata record in DRO • the full-text is not changed in any way The full-text must not be sold in any format or medium without the formal permission of the copyright holders.Please consult the full DRO policy for further details. Modelling and Experimental Verification of Heat Dissipation Mechanisms in an SU-8 Electrothermal MicrogripperBelen Solano AbstractWithin this work, a microgripper based on a hot-cold arm principle was tested to give a greater understanding of the associated heat dissipation methods. Experiments were conducted in air at atmospheric and sub-atmospheric pressure, and in helium, argon and helium at sub-atmospheric pressure. The change in deflection, when using gases with different thermal conductivities and at varying pressures showed the significance of conduction through the atmosphere. The experimental results were found to verify a theoretical model created previously by this group, and a further model developed independently; both predicted the deflection that a given current would cause.

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mentioning

confidence: 86%

Modelling and experimental verification of heat dissipation mechanisms in an SU-8 electrothermal microgripper

Solano

Merrell

Gallant

et al. 2014

Microelectronic Engineering

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“…Numerous research groups have developed numerical models of thermal microactuator performance Bergna et al, 2005;Enikov et al, 2005;Howell et al, 2007;Lott et al, 2002;Mankame and Ananthasuresh, 2001;Serrano et al, 2006;and Wong and Phinney, 2007). These models include electrical, thermal, and mechanical effects and are implemented through finite difference as well as finite element approaches.…”

Section: Modelingmentioning

confidence: 99%

Thermal Microactuators

Leslie¹,

Michael²,

Justin³

2012

Microelectromechanical Systems and Devices

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“…Because of this, it is difficult to derive a closed-form solution that can adequately model device performance; however, numerical models have been used with success. These range from finite-difference approaches to full three-dimensional finite element solutions [10][11][12].…”

Section: Model Developmentmentioning

confidence: 99%

Final report : compliant thermo-mechanical MEMS actuators, LDRD #52553.

Walraven¹,

Baker²,

Headley³

et al. 2004

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Thermal actuators have proven to be a robust actuation method in surface-micromachined MEMS processes. Their higher output force and lower input voltage make them an attractive alternative to more traditional electrostatic actuation methods. A predictive model of thermal actuator behavior has been developed and validated that can be used as a design tool to customize the performance of an actuator to a specific application. This tool has also been used to better understand thermal actuator reliability by comparing the maximum actuator temperature to the measured lifetime.Modeling thermal actuator behavior requires the use of two sequentially coupled models, the first to predict the temperature increase of the actuator due to the applied current and the second to model the mechanical response of the structure due to the increase in temperature. These two models have been developed using Matlab for the thermal response and ANSYS for the structural response. Both models have been shown to agree well with experimental data. 3In a parallel effort, the reliability and failure mechanisms of thermal actuators have been studied. Their response to electrical overstress and electrostatic discharge has been measured and a study has been performed to determine actuator lifetime at various temperatures and operating conditions. The results from this study have been used to determine a maximum reliable operating temperature that, when used in conjunction with the predictive model, enables us to design in reliability and customize the performance of an actuator at the design stage. AcknowledgmentThe authors would like to thank all of the staff in the MDL for fabrication and release/dry/coat support through out this project. We would also like to thank Ken Pohl, Mark Jenkins and David Luck for their assistance in testing and characterization, Mike Rye for TEM sample preparation, and Hoshang (Amir) Shahvar and Ted Parson for their work in getting SHiMMeR operational and configured for this experiment. Also, thanks to Sean Kearney and Leslie Phinney for their work in collecting the Raman temperature data.4

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Modeling the thermal behavior of a surface-micromachined linear-displacement thermomechanical microactuator

Cited by 182 publications

References 18 publications

Modelling and experimental verification of heat dissipation mechanisms in an SU-8 electrothermal microgripper

Modelling and experimental verification of heat dissipation mechanisms in an SU-8 electrothermal microgripper

Thermal Microactuators

Final report : compliant thermo-mechanical MEMS actuators, LDRD #52553.

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