No abstract

This work examines the metallization of folded DNA, known as DNA origami, as an enabling step toward the use of such DNA as templates for nanoelectronic circuits. DNA origami, a simple and robust method for creating a wide variety of shapes and patterns, makes possible the increased complexity and flexibility needed for both the design and assembly of useful circuit templates. In addition, selective metallization of the DNA template is essential for circuit fabrication. Metallization of DNA origami presents several challenges over and above those associated with the metallization of other DNA templates such as λ-DNA. These challenges include (1) the stability of the origami in the processes used for metallization, (2) the enhanced selectivity required to metallize small origami structures, (3) the increased difficulty of adhering small structures to the surface so that they will not be removed when subject to multiple metallization steps, and (4) the influence of excess staple strands present with the origami. This paper describes our efforts to understand and address these challenges. Specifically, the influence of experimental conditions on template stability and on the selectivity of metal deposition was investigated for small DNA origami templates. These templates were seeded with Ag and then plated with Au via an electroless deposition process. Both staple strand concentration and the concentration of ions in solution were found to have a significant impact. Selective continuous metal deposition was achieved, with an average metallized height as small as 32 nm. The shape of branched origami was also retained after metallization. These results represent important progress toward the realization of DNA-templated nanocircuits.

DNA origami is a promising tool for use as a template in the design and fabrication of nanoscale structures. The ability to engineer selected staple strands on a DNA origami structure provides a high density of addressable locations across the structure. Here we report a method using site-specific attachment of gold nanoparticles to modified staple strands and subsequent metallization to fabricate conductive wires from DNA origami templates. We have modified DNA origami structures by lengthening each staple strand in select regions with a 10-base nucleotide sequence and have attached DNA-modified gold nanoparticles to the lengthened staple strands via complementary base-pairing. The high density of extended staple strands allowed the gold nanoparticles to pack tightly in the modified regions of the DNA origami, where the measured median gap size between neighboring particles was 4.1 nm. Gold metallization processes were optimized so that the attached gold nanoparticles grew until gaps between particles were filled and uniform continuous nanowires were formed. Finally, electron beam lithography was used to pattern electrodes in order to measure the electrical conductivity of metallized DNA origami, which showed an average resistance of 2.4 kΩ per metallized structure.

This paper documents an experimental study to compare the behavior of bis-͑3-sodiumsulfopropyl͒ disulfide ͑SPS͒-Clpolyethylene glycol ͑PEG͒ and 3-mercaptopropanesulfonic acid sodium salt ͑MPSA͒-Cl-PEG additive systems during copper electrodeposition. These systems are analogous to those used industrially to plate copper lines onto integrated circuits. Galvanostatic experiments show that in the absence of chloride ion, either SPS or MPSA added to the plating solution inhibited copper deposition. Upon the addition of Cl − , a rapid transition from inhibition to acceleration was observed for both additives, illustrating the critical role played by the chloride ion in these systems. Potentiostatic experiments performed for the Cl-PEG-SPS and Cl-PEG-MPSA additive systems show that the potential dependency of the Cl-PEG-SPS system was much stronger than that of the MPSA-Cl-PEG system. Differences between the SPS and MPSA additive systems suggest that acceleration may occur through an MPSA pathway. Finally, results with chemical compounds similar to MPSA indicate that the thiol group is associated with inhibition and that a synergistic accelerating relationship exists between the sulfonate group and chloride, presumably due to complex formation.

Electrical conductivity measurements were performed on single apoferritin and holoferritin molecules by conductive atomic force microscopy. Conductivity of self-assembled monolayer films of ferritin molecules on gold surfaces was also measured. Holoferritin was 5-15 times more conductive than apoferritin, indicating that for holoferritin most electron-transfer goes through the ferrihydrite core. With 1 V applied, the average electrical currents through single holoferritin and apoferritin molecules were 2.6 pA and 0.19 pA, respectively.