Modeling the copper microstructure and elastic anisotropy and studying its impact on reliability in nanoscale interconnects

Abstract

Background: Copper is the primary metal used in integrated circuit manufacturing of today. Even though copper is face centered cubic it has significant mechanical anisotropy depending on the crystallographic orientations. Copper metal lines in integrated circuits are polycrystalline and typically have lognormal grain size distribution. The polycrystalline microstructure is known to impact the reliability and must be considered in modeling for better understanding of the failure mechanisms. Methods: In this work, we used Voronoi tessellation to model the polycrystalline microstructure with lognormal grainsize distribution for the copper metal lines in test structures. Each of the grains is then assigned an orientation with distinct probabilistic texture and corresponding anisotropic elastic constants based on the assigned orientation. The test structure is then subjected to a thermal stress.

Ultra-wideband optical coherence elastography from acoustic to ultrasonic frequencies

“…4c). These values were consistent with their quasi-static shear moduli 44,45 , indicating their near-pure elasticity. We also performed OCE on the cortical surface of a bovine tibia bone specimen (ρ = 1.6 g/cm 3 and ν = 0.3) and found μ to vary from 2.36 ± 0.04 GPa at 485 kHz to 3.60 ± 0.12 GPa at 2 MHz (Fig.…”

Tensile and Compressive Behavior of CHC‐Reinforced Copper using Molecular Dynamics

“…The mechanical properties extracted from these curves are presented in Table 4. The Young's modulus obtained for recrystallized Cu (111 GPa) is in good agreement with the accepted value for Cu (120 GPa-not single crystal), [45] although the purpose of recrystallizing the pure Cu matrix is for comparison purposes with the mechanical properties of the nanocomposites and not for obtaining the mechanical properties of the metal, since the quenched method used here and the size of the simulated system are not optimized for that objective.…”

Investigating Mechano-Electrochemical Coupling Phenomenon in Lithium-Ion Pouch Cells Using In-situ Neutron Diffraction

“…The peak intensity of the copper (111) peak over the course of the experiment is plotted in Figure 4a. Under these moderate stress levels, it is not expected for the copper foil to experience phase changes or significant texture changes due to plastic deformation (24). However, as seen in Figure 4a, the copper (111) peak intensity increases after the first compression, and then shows fluctuations that follow the trend of mechanical loading and unloading.…”