Abstract:Epoxy molding compounds (EMC) have been widely used in electronic packaging industry as adhesives, for example, die-attach and underfill. However, interfaces between EMC and other components such as copper substrates are weak and prone to delamination, due to large interfacial stresses developed during thermal cycling processes. Cohesive zone finite element method is able to simulate fracture initiation and propagation along a prescribed path, thus is an ideal choice of interface performance evaluation. Howeve… Show more
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