2013
DOI: 10.1080/01694243.2013.837570
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Study on interfacial interaction energy of Cu–SAM–epoxy systems in a hot and humid environment

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Cited by 2 publications
(1 citation statement)
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“…In addition, the unshared electron pair of the cyano group allows for an increased reactivity toward molecular layer deposition . Cyano-terminated SAMs increase the surface energy of the low- k materials as compared with the originally hydrophobic −CH 3 functionality, improving the adhesion between the dielectric and the metal barrier. , In our recent publications, , CN-SAMs were deposited from the liquid and vapor phase on a porous low- k dielectric film activated by Ar/H 2 and Ar/N 2 plasma. Nevertheless, in both cases, despite the successful sealing, the film’s dielectric constant increased by 35% and 7% after Ar/N 2 and Ar/H 2 plasma preactivation followed by CN-SAM deposition.…”
Section: Introductionmentioning
confidence: 99%
“…In addition, the unshared electron pair of the cyano group allows for an increased reactivity toward molecular layer deposition . Cyano-terminated SAMs increase the surface energy of the low- k materials as compared with the originally hydrophobic −CH 3 functionality, improving the adhesion between the dielectric and the metal barrier. , In our recent publications, , CN-SAMs were deposited from the liquid and vapor phase on a porous low- k dielectric film activated by Ar/H 2 and Ar/N 2 plasma. Nevertheless, in both cases, despite the successful sealing, the film’s dielectric constant increased by 35% and 7% after Ar/N 2 and Ar/H 2 plasma preactivation followed by CN-SAM deposition.…”
Section: Introductionmentioning
confidence: 99%