Modeling of New Spiral Inductor Based on Substrate Integrated Suspended Line Technology

Li, Lianyue; Ma, Kaixue; Mou, Shouxian

doi:10.1109/tmtt.2017.2701374

Cited by 44 publications

(21 citation statements)

References 22 publications

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“…Since the measurement system is restricted above circa 100 GHz, the S-parameters of the proposed THz filter based on cylindrical TSV are investigated with the simplified power-loss method, which is adequate for the functional evaluation and inexpensive [16]. In order to eliminate the effect of the non-ideal factors in the measurement procedure, the open-short de-embedding method is utilized [17]. The measurement structure for the proposed THz cavity filter, including the open, short, and device-under-test structures are illustrated in Fig.…”

Section: A Fabrication and Measurementmentioning

confidence: 99%

Miniaturized SIW Bandpass Filter Based on TSV Technology for THz Applications

Wang

Pavlidis

2020

IEEE Trans. THz Sci. Technol.

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A miniaturized substrate integrated waveguide (SIW) bandpass filter with an area of 0.682×0.210 mm 2 is proposed based on Through-Silicon Via (TSV) technology for terahertz (THz) applications. The design method of the THz cavity filter based on rectangular TSV is introduced and the filtering characteristics are investigated by the finite element method (FEM) and mode matching method (MMM). The rectangular TSV is substituted by cylindrical structures and the THz cavity filter is fabricated and measured in order to investigate the possibility of integration with typical 3D IC manufacturing processes. The cavity filter utilizing cylindrical TSV exhibits a bandwidth of 0.051 THz centered at 0.331 THz, an insertion loss of 1.5 dB, and a reflection of higher than 15 dB in the passband.

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Section: A Fabrication and Measurementmentioning

confidence: 99%

Miniaturized SIW Bandpass Filter Based on TSV Technology for THz Applications

Wang

Pavlidis

2020

IEEE Trans. THz Sci. Technol.

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“…The quality factor of an inductor is most commonly defined as (11) -by grounding its second port [23][24][25][28][29][30]. It is usually evaluated until x changes sign and becomes negative.…”

Section: Applications In Reconfigurable Inductors With Vanadium DImentioning

confidence: 99%

“…Let us consider the circuit given in Fig. 13, which is the small signal equivalent circuit of a resonant tunnelling diode [30]. These diodes can be used as local oscillators in microwave and millimetre wave frequencies.…”

Section: A Frequency Dependent Examplementioning

confidence: 99%

3D Smith Chart Constant Quality Factor Semi-Circles Contours for Positive and Negative Resistance Circuits

et al. 2020

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The article firstly proves that the constant quality factor (Q) contours for passive circuits, while represented on a 2D Smith chart, form circle arcs on a coaxal circle family. Furthermore, these circle arcs represent semicircles families in the north hemisphere while represented on a 3D Smith chart. On the contrary, it then shows that, the constant Q contours for active circuits with negative resistance form complementary circle arcs on the same family of coaxal circles in the exterior of the 2D Smith chart. Moreover, we reveal that these constant Q contours represent complementary semicircles in the south hemisphere while represented on the 3D Smith chart for negative resistance circuits. The constant Q semicircles implementation in the 3D Smith chart computer aided design (CAD) tool is then successfully used to evaluate the quality factor variations of newly fabricated Vanadium dioxide inductors, directly from their reflection coefficient, as the temperature is increased from room temperature to 50 degrees Celsius (°C). Thus, a direct multi-parameter frequency dependent analysis is proposed including Q, inductance and reflection coefficient for inductors. Then, quality factor direct evaluation is used for two tunnel diode small signal equivalent circuits analysis, allowing for the first time the direct analysis of the Q and input impedance on a 3D Smith chart representation of a circuit, while including negative resistance.

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“…In this Letter, Agilent N5244A vector network analyser is employed to test the S ‐parameter of LPF. To eliminate the influences of the non‐ideal factors of the measurement procedure, the open‐short de‐embedding method is utilised [12]. The test structure of the LPF is shown in Fig.…”

Section: Measurementmentioning

confidence: 99%

“…It can be observed that the uniformity of the manufacturing process is satisfactory. de-embedding method is utilised [12]. The test structure of the LPF is shown in Fig.…”

mentioning

confidence: 99%

Fabrication and measurement of 3D LPF based on coaxial TSV

Wang

2019

Electron. lett.

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The implementation of mainstream passive low-pass filters (LPFs) remains a challenge to satisfy the requirements of small size and compatibility with standard CMOS process. Fortunately, the emerging technology of through-silicon via (TSV) offers a possible solution to this issue by developing 3D LPF architecture. A 3D LPF based on coaxial TSV is exploited by fabrication and measurement. The measurement result shows good agreement with that obtained by finite element method.

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Modeling of New Spiral Inductor Based on Substrate Integrated Suspended Line Technology

Cited by 44 publications

References 22 publications

Miniaturized SIW Bandpass Filter Based on TSV Technology for THz Applications

Miniaturized SIW Bandpass Filter Based on TSV Technology for THz Applications

3D Smith Chart Constant Quality Factor Semi-Circles Contours for Positive and Negative Resistance Circuits

Fabrication and measurement of 3D LPF based on coaxial TSV

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