Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach

Mariani, Stefano; Ghisi, Aldo; Corigliano, Alberto; Zerbini, Sarah

doi:10.3390/s90100556

Cited by 43 publications

(28 citation statements)

References 22 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Shock fracture of polysilicon is more challenging and stochastic than SCS, as grain boundaries and elastic anisotropy within the polycrystalline grain structure give rise to complex internal elastic wave interactions and reflections. 251,252 However, most computational analysis of shock loading in MEMS treat the material as a homogeneous isotropic continuum. To evaluate devices for shock loading, most often a dynamic computational analysis is performed for the device geometry to determine the peak stresses during the shock, and those stresses are compared against measured quasi-static strength values to determine a safety factor.…”

Section: Environmentmentioning

confidence: 99%

Fracture strength of micro- and nano-scale silicon components

DelRio

Cook

Boyce

2015

Applied Physics Reviews

100

View full text Add to dashboard Cite

Silicon devices are ubiquitous in many micro- and nano-scale technological applications, most notably microelectronics and microelectromechanical systems (MEMS). Despite their widespread usage, however, issues related to uncertain mechanical reliability remain a major factor inhibiting the further advancement of device commercialization. In particular, reliability issues related to the fracture of MEMS components have become increasingly important given continued reductions in critical feature sizes coupled with recent escalations in both MEMS device actuation forces and harsh usage conditions. In this review, the fracture strength of micro- and nano-scale silicon components in the context of MEMS is considered. An overview of the crystal structure and elastic and fracture properties of both single-crystal silicon (SCS) and polycrystalline silicon (polysilicon) is presented. Experimental methods for the deposition of SCS and polysilicon films, fabrication of fracture-strength test components, and analysis of strength data are also summarized. SCS and polysilicon fracture strength results as a function of processing conditions, component size and geometry, and test temperature, environment, and loading rate are then surveyed and analyzed to form overarching processing-structure-property-performance relationships. Future studies are suggested to advance our current view of these relationships and their impacts on the manufacturing yield, device performance, and operational reliability of micro- and nano-scale silicon devices.

show abstract

Section: Environmentmentioning

confidence: 99%

Fracture strength of micro- and nano-scale silicon components

DelRio

Cook

Boyce

2015

Applied Physics Reviews

100

View full text Add to dashboard Cite

show abstract

“…Reliability of packaged polysilicon microelectromechanical systems involves the computational study of environmental effects to predict the long-term performance of MEMS packages at mesoscopic and microscopic length scales. The authors in [72] present a multiscale finite element modeling (FEM) approach coupled to Monte-Carlo (MC) analysis for MEMS failure prediction. In a same way, a predictive-science-based multiscale modeling and simulation platform is proposed in [78] to predict material performance issues, such as radiation, thermo-mechanical cycling and damage and fracture due to shocks.…”

Section: ) Multiscale Modelsmentioning

confidence: 99%

“…System-level FEM/CGMD coupled models [68] MEMS part-level FEM/MC coupled models [72][73], [74] System-level continuum/MD/QM coupled models [75], [76] System-level where n is the number of features in environment.…”

Section: (Ii) Concurrent Multiscale Simulationsmentioning

confidence: 99%

A Survey of Modeling and Control Techniques for Micro- and Nanoelectromechanical Systems

Ferreira

Aphale

2011

IEEE Trans. Syst., Man, Cybern. C

View full text Add to dashboard Cite

Abstract-In the current times, MEMS and NEMS form a major inter-disciplinary area of research involving science, engineering and technology. A lot of work has been reported in the area of modeling and control of these devices, with the aim of better understanding their behavior and improving their performance. This work presents a review of the emerging advances in the modeling and control of these micro-and nanoscale devices and converges on the exciting research in onchip control, with a mechatronics and controls perspective and concludes by projecting future trends.

show abstract

“…These accelerometers, however, require complex signal processing steps (e.g., amplification, filtering, and conversion). Furthermore, they use a proof mass that is suspended by fixed beams that are complicated to fabricate and may incur mechanical fatigue [5][6][7][8][9].…”

Section: Introductionmentioning

confidence: 99%

Simple and robust resistive dual-axis accelerometer using a liquid metal droplet

Huh

Won

Kim

et al. 2017

Micro and Nano Syst Lett

View full text Add to dashboard Cite

This paper presents a novel dual-axis accelerometer that consists of a liquid metal droplet in a cone-shaped channel and an electrode layer with four Nichrome electrodes. The sensor uses the advantages of the liquid metal droplet (i.e., high surface tension, electrical conductivity, high density, and deformability). The cone-shaped channel imposes a restoring force on the liquid metal droplet. We conducted simulation tests to determine the appropriate design specifications of the cone-shaped channel. Surface modifications to the channel enhanced the nonwetting performance of the liquid metal droplet. The performances of the sensor were analyzed by a tilting test. When the acceleration was applied along the axial direction, the device showed ~6 kΩ/g of sensitivity and negligible crosstalk between the Xand Y-axes. In a diagonal direction test, the device showed ~4 kΩ/g of sensitivity.

show abstract

Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach

Cited by 43 publications

References 22 publications

Fracture strength of micro- and nano-scale silicon components

Fracture strength of micro- and nano-scale silicon components

A Survey of Modeling and Control Techniques for Micro- and Nanoelectromechanical Systems

Simple and robust resistive dual-axis accelerometer using a liquid metal droplet

Contact Info

Product

Resources

About