Modeling and mixed signal simulation of embedded passive components in high performance packages

Sood, Ashok K.; Choi, Kwang Lim; Haridass, A.; Na, N.; Swaminathan, Madhavan

doi:10.1109/icmcm.1998.670832

Cited by 9 publications

(6 citation statements)

References 3 publications

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“…The modeled resistance value of 858 (specification) was measured to have a resistance of 868 using an LCR meter. By adjusting the , , and terms in (11), the agreement between model and measurement was improved as shown in Fig. 11.…”

Section: Measurement Correlationmentioning

confidence: 99%

“…An example of a two-port circuit is the admittance parameters , , , and for an embedded resistor. This can be represented in equation form as (10) where (11) In (11), the admittance parameters have a common denominator and hence the same poles. The coefficients, and are obtained by solving (9) where is, as shown in (12) at the bottom of the page, and " " is the number of parameters to be solved for a common denominator.…”

Section: Developing Macromocels In Spicementioning

confidence: 99%

“…The SPICE macromodels were simulated in the time domain and correlated with time domain reflectometry (TDR) and time domain transmission (TDT) measurements [10], [11]. The measurement set-up consisted of Tektronix 11 801B digital sampling oscilloscope, SD-24 (20 GHz bandwidth) sampling heads with dual channels, Cascade Microtech G-S-G probes, Cascade Microtech probe station, and high frequency Gore cables.…”

Section: Measurement Correlationmentioning

confidence: 99%

See 2 more Smart Citations

Characterization of embedded passives using macromodels in LTCC technology

Choi

Na²,

Swaminathan

1998

IEEE Trans. Comp., Packag., Manufact. Technol. B

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This paper discusses the frequency and time domain response of embedded passive components in a multilayered structure fabricated using low temperature co-fired ceramic (LTCC) technology. A rational polynomial approximation that combines the accuracy of EM solvers with interpolation methods has been used to capture the frequency dependent losses and parasitics of embedded passives in a macro-model. This method allows for a significant speed-up in computation time while using commercial EM solvers. The macromodel with suitable modification has been used to compute the time domain response in SPICE for typical embedded passive structures. Simulation results show good correlation with time domain reflectometry/time-domaintransmission (TDR/TDT) measurements. The behavior of embedded passives in the high frequency operation of transmission lines and voltage divider networks has also been discussed.

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Section: Measurement Correlationmentioning

confidence: 99%

Section: Developing Macromocels In Spicementioning

confidence: 99%

Section: Measurement Correlationmentioning

confidence: 99%

See 1 more Smart Citation

Characterization of embedded passives using macromodels in LTCC technology

Choi

Na²,

Swaminathan

1998

IEEE Trans. Comp., Packag., Manufact. Technol. B

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“…For example, electrical and mechanical modeling of embedded capacitors were investigated by Rao et al using the finite element method [5]. Sood et al studied macromodeling of embedded passive components in high performance LTCC packages using SPICE simulation [6]. Fathy et al presented modeling and design guidelines for embedded passives in LTCC on metal technology [7].…”

Section: Introductionmentioning

confidence: 99%

Modeling and analysis of 3-D solenoid embedded inductors

Lee

Choi

May

et al. 2002

IEEE Trans. Electron. Packag. Manufact.

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Investigation of the statistical variation of integrated passive components is crucial for designing and characterizing the performance of multichip module (MCM) substrates. In this paper, the statistical analysis of three-dimensional (3-D) solenoid inductors manufactured in a multilayer low-temperature cofired ceramic (LTCC) process is presented. A set of integrated inductor structures is fabricated, and their scattering parameters are measured for a range of frequencies from 50 MHz to 5 GHz. Using optimized equivalent circuits obtained from HSPICE, mean and absolute deviation is calculated for each component of each device model. Monte Carlo Analysis for the inductor structures is then performed using HSPICE. Using a comparison of the Monte Carlo results and measured data, it is determined that for even a small number of sample structures, the statistical variation of the component values provides an accurate representation of the overall inductor performance.Index Terms-Embedded passives, low-temperature cofired ceramic (LTCC), Monte Carlo analysis, statistical variation.

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“…For example, electrical and mechanical modelings of embedded capacitors were investigated by Rao et al using the finite element method [5]. Sood et al studied macromodeling of embedded passive components in high performance LTCC packages using SPICE simulation [6]. Fathy et al presented modeling and design guidelines for embedded passives in LTCC on metal technology [7].…”

Section: Introductionmentioning

confidence: 99%