Characterization of embedded passives using macromodels in LTCC technology

Abstract

This paper discusses the frequency and time domain response of embedded passive components in a multilayered structure fabricated using low temperature co-fired ceramic (LTCC) technology. A rational polynomial approximation that combines the accuracy of EM solvers with interpolation methods has been used to capture the frequency dependent losses and parasitics of embedded passives in a macro-model. This method allows for a significant speed-up in computation time while using commercial EM solvers. The macromodel with suitable modification has been used to compute the time domain response in SPICE for typical embedded passive structures. Simulation results show good correlation with time domain reflectometry/time-domaintransmission (TDR/TDT) measurements. The behavior of embedded passives in the high frequency operation of transmission lines and voltage divider networks has also been discussed.

An Improved Distributed Equivalent Circuit Modeling for RF Components by Real-Coefficient AFS Technique

“…All the components have functions and dimensional efficiencies. However, although artwork is carefully done, the complicated layout may possibly cause EMC (Electromagnetic Compatibiliy) and performance problems [1].…”

Comparison of methods for modeling ALAN's power plane structure

“…Since only the ports for 'S', 'Ml' and 'M2' need to be observed for the response, the submatrices Z,, and Zbb are taken and used for deriving the expression for the total response of only those ports: (4) where la, 2a and 3a represent the ports for 'S', 'MI' and 'A' and l b and 2b represent the ports for 'M2' and 'B', respectively. Considering the current-voltage relation at 'A' and 'B' [3], the total response of the whole system is derived for the ports 'S', 'Ml' and 'M2' only as: x 108 (b) Fig.…”