Modeling and experimental study of machining outcomes when conducting nanoscratching using dual-tip probe on single-crystal copper

Geng, Yanquan; Jia, Junshuai; Liu, Yu; Wang, Jiqiang; Yan, Yongda; Gan, Yang

doi:10.1016/j.ijmecsci.2021.106649

Cited by 11 publications

(2 citation statements)

References 49 publications

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“…Nanoscratching has been performed on various materials including polymers, semiconductors, and metals. [10][11][12] However, nanoscratching possesses several critical limitations that have prevented it from becoming a widely used nanolithography technique beyond a few niche applications. First, the shear forces applied always result in tip damage [13] thus leading to a gradual decrease of pressure for the same force applied and result in inhomogeneous features designed.…”

Section: Introductionmentioning

confidence: 99%

A New Method of AFM‐Based Nanolithography Using Frequency Enhanced Electrochemical Pressure Solution Etching

Fraysse

MacLeod

Gates

et al. 2023

Adv Materials Technologies

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A new method of direct‐write nanolithography that is able to rapidly etch silica surfaces under a scanning atomic force microscopy (AFM) probe in tapping mode (TM) is reported. In this lithography technique, silica surfaces are etched using a recently described electro‐chemo‐mechanical phenomenon of frequency enhanced electrochemical pressure solution (FEEPS). In FEEPS, the tapping of the AFM tip generates oscillations of the Stern potential at the silica‐water interface that can accelerate the silica dissolution kinetics by more than 5–6 orders of magnitude when surface resonance states are achieved; i.e., when the oscillation frequency is in phase with the dynamics of interfacial chemical reaction steps. By scanning silica surfaces in TM, silica is selectively dissolved below the tapping tip as it is scanned. The FEEPS accelerated silica dissolution rates can generate etched features with depths of more than 60 nm in a single AFM tip pass. The rate of etching can be controlled easily by varying the scanning rate or by modulating the tapping frequency. This fine control over the silica etching process and because material is removed (dissolved) rather than displaced as with nanoscratching, the FEEPS process lends itself to gray‐scale nanolithography which is demonstrated.

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Section: Introductionmentioning

confidence: 99%

A New Method of AFM‐Based Nanolithography Using Frequency Enhanced Electrochemical Pressure Solution Etching

Fraysse

MacLeod

Gates

et al. 2023

Adv Materials Technologies

View full text Add to dashboard Cite

show abstract

“…Molecular dynamics (MD) simulations have been proven to be a powerful tool to investigate the material removal mechanism at atomic scale. The effects of polishing speed [14][15][16], polishing depth [17][18][19][20], rotating velocity [21,22], grain size [23,24], normal pressure [25][26][27] and crystal orientation [28] on the surface quality of the work piece have been systematically investigated based on MD simulations. Zhang et al [29] studied the effects of grinding depths and speeds on the subsurface damage layer (SDL).…”

Section: Introductionmentioning

confidence: 99%