Exploring the nano-polishing mechanisms of Invar

Wang, Wan; Hua, Dongpeng; Luo, Dawei; Zhou, Qing; Eder, Stefan J.; Li, Shuo; Wang, Zhijun; Wang, Haifeng

doi:10.1016/j.triboint.2022.107840

Cited by 11 publications

(3 citation statements)

References 78 publications

(90 reference statements)

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“…The components of MEMS scrape against each other frequently while working. To investigate the effects of scraping velocity on nickel-copper substrate, we set five translation velocities and five rotation velocities according to [29,30] and the characteristic of model in this paper. Rolling scraping occurs between abrasive and substrate when translation velocity is equal to rotation velocity.…”

Section: Effects Of Abrasive Velocitymentioning

confidence: 99%

Molecular dynamics simulations into rolling scraping of nickel-copper bilayer film

Dai,

Gao,

Yao

2024

Modelling Simul. Mater. Sci. Eng.

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In order to investigate the nanoscale friction mechanism and deformation behavior of nickel-copper bilayer film under rolling scraping, the effects of different factors during friction process such as the translation velocity, rotation velocity, radius of abrasive grain, contact depth, texture direction and crystallographic orientation are analyzed through molecular dynamics methods in terms of contact force, atomic lattice structure, internal substrate dislocation, kinetic energy and temperature. Results show that the contact force increases with the increase of the translation velocity or the decrease of the rotation velocity. Abrasive grains in a purely rolling state cause the most serious damage to the substrate. The contact force increases with the increase of contact depth or the decrease of abrasive grain radius, the amount of change in temperature and kinetic energy both increase with contact depth and abrasive radius. The crystallographic orientation has a significant effect on rolling scraping process and there is a crystallographic orientation with the minimum contact force. The degrees of substrate dislocation and the numbers of lattice reconstruction atoms under different factors and levels vary widely.

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Section: Effects Of Abrasive Velocitymentioning

confidence: 99%

Molecular dynamics simulations into rolling scraping of nickel-copper bilayer film

Dai,

Gao,

Yao

2024

Modelling Simul. Mater. Sci. Eng.

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“…To balance the efficiency of the grinding process with the surface quality, a compromise has to be made between the material removal rate and the final surface roughness (Stephenson et al, 2001;Gopal and Rao, 2003). Higher material removal rates, resulting for example from higher grinding speeds, usually deteriorate the surface quality (Wang et al, 2022), while high surface quality is usually achieved by using small pressures and low material removal rates. If the grinding parameters are carefully chosen, roughness values in the range of 0.3 nm with an accuracy of 10 nm of geometrical features can be achieved in ultra-precision processes, thus making any subsequent polishing processes unnecessary (Wegener et al, 2017).…”

Section: Introductionmentioning

confidence: 99%

“…Grinding is an extremely complicated process, which is affected by a number of parameters, such as the material of the abrasives and the work piece as well as their microstructure, the pressure, the temperature, the geometry and orientation of the abrasives, as well as the cutting speed and other machine parameters (Gopal and Rao, 2003;Eder et al, 2022;Wang et al, 2022). Often the correct operation of the grinding process can be determined by the existence and the shape of the formed chips (Rasim et al, 2015;Karasawa et al, 2019).…”

Section: Introductionmentioning

confidence: 99%

Towards a multi-abrasive grinding model for the material point method

Leroch

Grützmacher²,

Heckes

et al. 2023

Front. Manuf. Technol.

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An efficient optimization of surface finishing processes can save high amounts of energy and resources. Because of the large occurring deformations, grinding processes are notoriously difficult to model using standard (mesh-based) micro-scale modeling techniques. In this work, we use the meshless material point method to study the influence of abrasive shape, orientation, rake angle, and infeed depth on the grinding result. We discuss the chip morphology, the surface topography, cutting versus plowing mode, the material removal rate, and the chip temperature. A generalization of our model from a straightforward single-abrasive approach to a multiple-abrasive simulation with pseudo-periodical boundary conditions greatly increases the degree of realism and lays the foundation for comparison with real finishing processes. We finally compare our results for multiple abrasives to those obtained for a scaled-down molecular dynamics system and discuss similarities and differences.

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