volume 51, issue 3, P763-773 2009
DOI: 10.1109/temc.2009.2026637
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Abstract: Abstract-A new hybrid modeling method is proposed for the chip-package comodeling and coanalysis. This method is designed to investigate the simultaneous switching noise (SSN) coupling paths and effects on the dc output voltage offset of the operational amplifier (OpAmp). It combines an analytical model of the circuit with a power distributed network (PDN) and interconnection models at the chip and package substrate. In order to validate the proposed model, CMOS OpAmp was fabricated using TSMC 0.25 µm. Then t…

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