Model for predicting performance of cooling fans for thermal design of electronic equipment (Modeling and evaluation of effects from electronic enclosure and inlet sizes)

Fukue, Takashi; Ishizuka, Masaru; Nakagawa, Shinji; Hatakeyama, Tomoyuki; Koizumi, Katsuhiro

doi:10.1002/htj.20347

Cited by 3 publications

(1 citation statement)

References 12 publications

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“…Like other high-power PEDs, the insulated gate bipolar transistor (IGBT) module in dynamic reactive power compensation systems also has thermal design requirements [8,9]. Lee et al [10] carried out finite-element analysis on the flow field and temperature field of closed electronic equipment with radiators of different structures, and provided the steps for optimal design of water-cooling radiators.…”

Section: Introductionmentioning

confidence: 99%

Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices

Zheng-de¹

2021

IJHT

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In electronic equipment, thermal failure and thermal degradation are two increasingly prominent problems of the devices, with the deepening integration and growing power density. Currently, there are relatively few reports on the heat transfer mechanism, heat source analysis, and numerical simulation of electronic equipment containing power electronic devices (PEDs). Therefore, this paper carries out thermal design and evaluates the cooling performance of PED-containing electronic equipment. Firstly, the basic flow was given for the thermal design of PED-containing electronic equipment; the heat transfer mode of PEDs and the equipment were detailed, so was the principle of thermal design; the cooling principles were introduced for ventilation cooling, heat pipe cooling, and closed loop cooling. Then, numerical simulation was carried out on the solid and liquid state heat transfer of PEDs and the equipment under different cooling modes. Based on an engineering example, the cooling scheme was finalized through heat source analysis on the proposed electronic equipment. The experimental results rove the effectiveness of numerical simulation and electronic equipment cooling scheme. The results provide a reference for the cooling scheme design for other fields of thermal design.

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Section: Introductionmentioning

confidence: 99%

Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices

Zheng-de¹

2021

IJHT

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Application analysis of efficient heat dissipation of electronic equipment based on flexible nanocomposites

Yang

Yao

Jia

et al. 2021

Energy and Built Environment

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MRF Modeling of Axial Fan for Thermal Simulation of Electronic Equipment

Koizumi¹,

Hatakeyama

Fukue

et al. 2014

Transactions of The Japan Institute of Electronics Packaging

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Nowadays, thermal flow simulation based on computational fluid dynamics (CFD) is applied to the thermal design of electronic equipment. In this paper, we discuss the applicability of the multiple reference frame (MRF) approach, which is a new method for modeling an axial cooling fan, to the thermal flow simulation of electronic equipment using the CFD code. In this study, as the first step, flow visualization of the exhaust air flow pattern of the experimental axial fan was conducted. Then the flow visualization results were compared with the MRF fan model simulation results. Finally, the P-Q characteristic obtained by MRF fan model simulation was compared with the measured P-Q characteristic to validate the applicability of the MRF approach to the thermal flow simulation of electronic equipment.

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Model for predicting performance of cooling fans for thermal design of electronic equipment (Modeling and evaluation of effects from electronic enclosure and inlet sizes)

Cited by 3 publications

References 12 publications

Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices

Thermal Design and Cooling Performance Evaluation of Electronic Equipment Containing Power Electronic Devices

Application analysis of efficient heat dissipation of electronic equipment based on flexible nanocomposites

MRF Modeling of Axial Fan for Thermal Simulation of Electronic Equipment

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