Deep level transient spectroscopy (DLTS) is performed in metal organic chemical vapour deposition (MOCVD) hexagonal GaN doped with silicon either intentionally or not. Capacitance transients are measured in junctions and analysed with the help of several techniques. In these samples, the main contribution due to deep levels appears as a prominent peak in the Fourier transform DLTS (FTDLTS) spectrum with an apparent ionisation energy of 0.95 eV and a capture cross section close to 5 × 10 -15 cm 2 . However, these values must be considered as apparent ones. Isothermal transient spectroscopy (ITS) and a high resolution method based on the analysis of the transients recorded over five decades of time show that several sub-levels exist with ionisation energies between 0.40 and 0.76 eV, and capture cross sections in the range 5 × 10 Introduction Deep levels within the forbidden band gap of semiconductors have detrimental effects upon several electrical characteristics of the devices build with such materials. However, both the electronic properties and the microscopic nature of the defects are not well understood. Deep level transient spectroscopy (DLTS) techniques appear to be quite relevant for the study of such defects. They have been used previously in GaN prepared by molecular beam epitaxy (MBE) [1], metal-organic chemical vapour decomposition (MOCVD) [2 -4] and hydride vapour phase epitaxy (HVPE) [5]. In the present study, they are applied to several n-type GaN samples prepared by MOCVD, doped with silicon, either voluntarily or not. Deep centres are evidenced here by techniques with an increasing energy resolution and their correlation with both the silicon presence and structural defects is emphasised. Moreover, some instabilities in the current-voltage characteristics of the diode, induced by electrical or light stress, are shown and discussed.