Mitigation and Verification Methods for Sn Whisker Growth in Pb-Free Automotive Electronics

Hong, Won Sik; Oh, Chul; Kim, Do Seop

doi:10.1007/s11664-012-2308-y

Cited by 7 publications

(1 citation statement)

References 15 publications

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“…Such coatings also provide a degree of protection from whisker growth. [21][22][23] Atomic later deposition (ALD) coatings are currently utilised for corrosion protection in many industrial and commercial applications, and therefore represent an interesting option for the protection of assembled electronic circuit boards and modules, especially in specific high-end applications. ALD has been studied previously alongside other coating methods and materials, and has been shown to give promising results with regards to tin whisker mitigation, see e.g.…”

Section: Introductionmentioning

confidence: 99%

Atomic Layer Deposition (ALD) to Mitigate Tin Whisker Growth and Corrosion Issues on Printed Circuit Board Assemblies

Kutilainen¹,

Pudas

Ashworth

et al. 2019

Journal of Elec Materi

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This paper presents the results of a research program set up to evaluate atomic layer deposition (ALD) conformal coatings as a method of mitigating the growth of tin whiskers from printed circuit board assemblies. The effect of ALD coating process variables on the ability of the coating to mitigate whisker growth were evaluated. Scanning electron microscopy and optical microscopy were used to evaluate both the size and distribution of tin whiskers and the coating/whisker interactions. Results show that the ALD process can achieve significant reductions in whisker growth and thus offers considerable potential as a reworkable whisker mitigation strategy. The effect of ALD layer thickness on whisker formation was also investigated. Studies indicate that thermal exposure during ALD processing may contribute significantly to the observed whisker mitigation.

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Section: Introductionmentioning

confidence: 99%