Mitigating irreversible capacity losses from carbon agents via surface modification

Piper, Daniela Molina; Son, Seoung‐Bum; Travis, Jonathan J.; Lee, Younghee; Han, Sang Sub; Kim, Seul Cham; Oh, Kyu Hwan; George, Steven M.; Lee, Se-Hee; Ban, Chunmei

doi:10.1016/j.jpowsour.2014.11.032

Cited by 14 publications

(1 citation statement)

References 31 publications

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“…In this research, we provide a calculus‐based method using differential plots and integrations to differentiate the individual electrochemical behaviors of the graphite and Si components in such composite, and to identify the failure mechanism therein. A surface modification enabled by a molecular layer deposition (MLD) technique, recently demonstrated in our research group, has been applied on the G–Si composite electrodes to stabilize the surface of the Si component. With this artificial interphase layer, we demonstrate highly reversible G–Si electrodes with a specific capacity of ≈810 mAh g −1 (2 mAh cm −2 ) for hundreds of charge–discharge cycles.…”

Section: Introductionmentioning

confidence: 99%

Interfacially Induced Cascading Failure in Graphite‐Silicon Composite Anodes

et al. 2018

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Silicon (Si) has been well recognized as a promising candidate to replace graphite because of its earth abundance and high‐capacity storage, but its large volume changes upon lithiation/delithiation and the consequential material fracturing, loss of electrical contact, and over‐consumption of the electrolyte prevent its full application. As a countermeasure for rapid capacity decay, a composite electrode of graphite and Si has been adopted by accommodating Si nanoparticles in a graphite matrix. Such an approach, which involves two materials that interact electrochemically with lithium in the electrode, necessitates an analytical methodology to determine the individual electrochemical behavior of each active material. In this work, a methodology comprising differential plots and integral calculus is established to analyze the complicated interplay among the two active batteries and investigate the failure mechanism underlying capacity fade in the blend electrode. To address performance deficiencies identified by this methodology, an aluminum alkoxide (alucone) surface‐modification strategy is demonstrated to stabilize the structure and electrochemical performance of the graphite‐Si composite electrode. The integrated approach established in this work is of great importance to the design and diagnostics of a multi‐component composite electrode, which is expected to be high interest to other next‐generation battery system.

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Section: Introductionmentioning

confidence: 99%

Interfacially Induced Cascading Failure in Graphite‐Silicon Composite Anodes

et al. 2018

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Atomic Layer Deposition for Lithium‐Based Batteries

Nuwayhid

et al. 2016

Adv Materials Inter

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With the increasing demand for energy at a low cost and minimal environmental impact, the development of next‐generation high‐performance batteries has drawn considerable attention. Owing to the capability of forming conformal coatings of thin films and nanoparticles, atomic layer deposition (ALD) has shown great potential in deposition and surface modification of electrode materials with various nanostructures, deposition of solid‐state electrolyte, and fabrication of electrochemical catalysts. This paper reviews the recent development and applications of ALD in Li‐based batteries, especially beyond Li‐ion systems, and provides suggestions for further development of ALD techniques for these batteries.

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Atomic/Molecular Layer Deposition for Designer's Functional Metal–Organic Materials

Multia

Karppinen

2022

Adv Materials Inter

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organic ligands act as bridges between the metal centers to form infinite 1D, 2D, or 3D structures. These materials are often referred to as coordination polymer (CP) [1] or metal-organic framework (MOF) [2] materials; the latter term is used when the metal-organic material is crystalline and highly porous. [3] The research field of CP-and MOF-type materials has grown tremendously over the last two decades. The structural and chemical diversity of these materials has served as a continuous source of scientific excitement; the same diversity has also triggered huge technological interest as these materials possess enormous potential to be tailored for a wide variety of applications ranging from gas capture, storage, and separation to sensing, catalysis, optics, electronics, and energy storage. [4][5][6][7] Most of the targeted application breakthroughs of metal-organics require that these materials can be produced as highquality thin films and coatings, which can be integrated with the other components in the actual device configuration. The possibility to deposit such thin films in an industry-feasible manner on the substrate types needed, would be a major step forward in the field. [8] Traditionally, solvent-based processes such as liquid-phase epitaxy, Langmuir-Blodgett, layer-by-layer, and electrochemical deposition techniques have been used for metal-organic thin films. [9][10][11] These are, however, incompatible with the requirements set by the possible integration of the materials in microelectronics. This is due to corrosion and contamination risks, and the problems in patterning and precise deposition on high-aspect-ratio features. Hence, it is vital to develop solventfree thin-film deposition routes for the metal-organic material family. In the optimal case, these deposition methods should allow conformal coatings on large-area and high-aspect-ratio substrates.The currently strongly emerging ALD/MLD technique is uniquely suited to address the challenge in a scientifically elegant yet industrially feasible way. This technique is derived from the two parent gas-phase thin-film techniques: ALD for inorganic materials (mostly binary metal oxides, sulfides, and nitrides), [12][13][14] and its counterpart MLD for purely organic thin films (e.g., polyimides and polyamides). [15] In both cases, the attractive film growth characteristics are derived from the unique way of separating the different precursor gas pulses. Currently, ALD is the standard thin-film technology in many Atomic layer deposition (ALD) for high-quality conformal inorganic thin films is one of the cornerstones of modern microelectronics, while molecular layer deposition (MLD) is its less-exploited counterpart for purely organic thin films. Currently, the hybrid of these two techniques, i.e., ALD/MLD, is strongly emerging as a state-of-the-art gas-phase route for designer's metal-organic thin films, e.g., for the next-generation energy technologies. The ALD/MLD literature comprises nearly 300 original journal papers covering most of the alkali...

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Mitigating irreversible capacity losses from carbon agents via surface modification

Cited by 14 publications

References 31 publications

Interfacially Induced Cascading Failure in Graphite‐Silicon Composite Anodes

Interfacially Induced Cascading Failure in Graphite‐Silicon Composite Anodes

Atomic Layer Deposition for Lithium‐Based Batteries

Atomic/Molecular Layer Deposition for Designer's Functional Metal–Organic Materials

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