For the first time, a procedure has been established
for the growth
of surface-anchored metal–organic framework (SURMOF) copper(II)
benzene-1,4-dicarboxylate (Cu-BDC) thin films of thickness control
with single molecule accuracy. For this, we exploit the novel method
solution atomic layer deposition (sALD). The sALD growth rate has
been determined at 4.5 Å per cycle. The compact and dense SURMOF
films grown at room temperature by sALD possess a vastly superior
film thickness uniformity than those deposited by conventional solution-based
techniques, such as dipping and spraying while featuring clear crystallinity
from 100 nm thickness. The highly controlled layer-by-layer growth
mechanism of sALD proves crucial to prevent unwanted side reactions
such as Ostwald ripening or detrimental island growth, ensuring continuous
Cu-BDC film coverage. This successful demonstration of sALD-grown
compact continuous Cu-BDC SURMOF films is a paradigm change and provides
a key advancement enabling a multitude of applications that require
continuous and ultrathin coatings while maintaining tight film thickness
specifications, which were previously unattainable with conventional
solution-based growth methods.