Abstract:Mismatch between outer lead bonds (OLBs) of a tape automated bonding (TAB) and a glass panel during fabrication is studied using the finite element method. A two-dimensional finite element model for the TAB-on Glass (TOG) connector is presented for determining the deformation of the connector. The deformation of the TOG connector induced by residual thermal stresses are determined via a two-stage approach. At the first stage, the TOG connector is under heat and pressure. The anisotropic conductive film (ACF) i… Show more
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