2007
DOI: 10.1016/j.tsf.2006.10.001
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Misfit dislocation network in Cu/Ni multilayers and its behaviors during scratching

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Cited by 35 publications
(22 citation statements)
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“…These boundaries have a low formation energy and hence, high thermal stability161718. It seems well understood that such interfaces contain three sets of dislocations ( a /2<110> or a /6<112>), depending on the stacking fault energy19202122. However, the node structure is rarely studied with respect to the node density and the character of interface dislocations.…”
mentioning
confidence: 99%
“…These boundaries have a low formation energy and hence, high thermal stability161718. It seems well understood that such interfaces contain three sets of dislocations ( a /2<110> or a /6<112>), depending on the stacking fault energy19202122. However, the node structure is rarely studied with respect to the node density and the character of interface dislocations.…”
mentioning
confidence: 99%
“…This is shown in the experimental results in Fig. 16.16 and in atomistic simulations of indentation (Cu-Ni [259,260] and Cu-Ag [261]) and scratch testing (Cu-Ni [262]). With minimal slip-plane misorientation, the strength of transparent A/B interfaces is attributed to a difference or 'mismatch' in (1) stress-free lattice parameter a 0 , (2) elastic shear modulus G (Koehler barrier), (3) chemistry (stacking-fault mismatch) g, and (4) Burgers vector b.…”
Section: Modeling and Simulation Atomisticsmentioning
confidence: 66%
“…4b. Note that the misfit dislocations network here does not have the shape of regular triangles as analyzed in [14]. A probable reason is that this network was formed during the dynamic process of deposition, and has not reached equilibrium before being covered and restricted by upper atomic layers.…”
Section: Competing Domainsmentioning
confidence: 88%